Patents by Inventor Markus Wöhrmann

Markus Wöhrmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer
    Patent number: 10074608
    Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: September 11, 2018
    Assignees: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Technische Universität Berlin
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann
  • METHOD FOR THE MANUFACTURE OF METAL STRUCTURES AND AN ELECTRONIC COMPONENT WITH AT LEAST ONE METAL STRUCTURE
    Publication number: 20170194257
    Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 6, 2017
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann