Patents by Inventor Markus W. Reiterer

Markus W. Reiterer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190126028
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 2, 2019
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 10245441
    Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: April 2, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Brad C. Tischendorf, Gordon O. Munns, Christian S. Nielsen, John D. Norton, Markus W. Reiterer, Andrew J. Thom, Kunal J. Paralikar
  • Patent number: 10201335
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 12, 2019
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Publication number: 20160331978
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: July 25, 2016
    Publication date: November 17, 2016
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 9398901
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: July 26, 2016
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 9299962
    Abstract: An encasement for an electrochemical cell and method of making such encasement is discloses. The design of the encasement results in an encasement having an area of high stress located away from the weld zone area of the encasement, where the cover and the case are welded together.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 29, 2016
    Assignee: Medtronic, Inc.
    Inventors: Hailiang Zhao, Steven J. May, Markus W. Reiterer, Bernard F. Heller
  • Publication number: 20150306414
    Abstract: An implantable active medical device includes a housing defining a hermetic cavity, a lead connector receptacle extending into the implantable active medical device, and a solid state light source disposed within the hermetic cavity and optically coupled to the lead connector receptacle.
    Type: Application
    Filed: April 23, 2015
    Publication date: October 29, 2015
    Inventors: Christian S. Nielsen, Kunal J. Paralikar, Brad C. Tischendorf, John D. Norton, Markus W. Reiterer, Andrew J. Thom, Gordon O. Munns
  • Publication number: 20150306415
    Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
    Type: Application
    Filed: April 23, 2015
    Publication date: October 29, 2015
    Inventors: Brad C. Tischendorf, Gordon O. Munns, Christian S. Nielsen, John D. Norton, Markus W. Reiterer, Andrew J. Thom, Kunal J. Paralikar
  • Publication number: 20140163646
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Publication number: 20130302665
    Abstract: An encasement for an electrochemical cell and method of making such encasement is discloses. The design of the encasement results in an encasement having an area of high stress located away from the weld zone area of the encasement, where the cover and the case are welded together.
    Type: Application
    Filed: March 14, 2013
    Publication date: November 14, 2013
    Applicant: MEDTRONIC, INC.
    Inventors: Hailiang Zhao, Steven J. May, Markus W. Reiterer, Bernard F. Heller
  • Publication number: 20130230424
    Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 5, 2013
    Applicant: Medtronic, Inc.
    Inventors: Markus W. Reiterer, Brad C. Tischendorf, Andrew J. Thom
  • Publication number: 20120265164
    Abstract: This relates to fluid delivery devices and methods and, more particularly, to implantable fluid delivery devices and methods of use. A flow restrictor for medical devices is described with particularly useful properties.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 18, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: Markus W. Reiterer, Dale F. Seeley, Kimberly A. Chaffin
  • Publication number: 20110106205
    Abstract: A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 ?m. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 ?m.
    Type: Application
    Filed: April 21, 2010
    Publication date: May 5, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: Markus W. Reiterer, Andrew J. Thom, Lea A. Nygren, William D. Wolf
  • Publication number: 20110106228
    Abstract: A method for making a feedthrough assembly for an implantable electronic medical device comprises providing a metallic ferrule having an outer surface and an aperture defined by an inner lumen surface; providing an insulator, the insulator having a first surface and a second surface. At least one of the first surface and the second surface of the insulator includes a brazing region disposed thereon. The braze material is applied to the brazing region and the insulator is positioned within or around the metallic ferrule such that the positioned insulator brazing region and the metallic ferrule outer surface or inner lumen surface defines a braze gap. The braze gap has a width ranging between 10 ?m to 50 ?m. The feedthrough assembly is then heated at a temperature conducive to melt the braze material in the braze gap thereby forming a hermetic seal between the ferrule and said insulator.
    Type: Application
    Filed: March 9, 2010
    Publication date: May 5, 2011
    Applicant: Medtronic, Inc.
    Inventors: Markus W. Reiterer, Andrew J. Thom