Abstract: A thermal fuse for an electrical circuit is described, with a contact arm by way of which two electrical conductors are electrically conductively connected to each other, wherein the connection of the contact arm to at least one of the two conductors is a soldered joint, which loses its strength when a activation temperature of the fuse is reached. In accordance with this disclosure a permanent magnet is provided, which generates a magnetic force, which lifts the contact arm from at least one of the two conductors as soon as the soldered joint loses its strength.

Abstract: A thermal fuse for an electrical circuit is described, with a contact arm by way of which two electrical conductors are electrically conductively connected to each other, wherein the connection of the contact arm to at least one of the two conductors is a soldered joint, which loses its strength when a activation temperature of the fuse is reached. In accordance with this disclosure a permanent magnet is provided, which generates a magnetic force, which lifts the contact arm from at least one of the two conductors as soon as the soldered joint loses its strength.

Abstract: There is provided an apparatus for attaching an item to a substrate, using a prong ring with a ring and two or more prongs. When attached, the prongs extends from the ring on a first side of the substrate through such substrate and being bent. A lower die is positioned to approach the first side of the substrate. An upper die is on a second side of the substrate. The substrate is placed in a manner substantially perpendicular to the attaching movement of the upper and lower dies and a first redirecting member for redirecting the prongs which are bent inwardly. The first redirecting member cooperates with an abutting member positioned along the approach of the prong ring towards the first side of the substrate for inhibiting movement of the prong ring towards the substrate while the first redirecting member is used.

Abstract: Disclosed is a printed circuit board having at least one power semiconductor soldered thereon and, as a thermal fuse, a spring having two contact arms fastened to solder pads of the printed circuit board by soldered connections. The spring is under mechanical stress such that at least one of the two contact arms moves away from one of the solder pads by spring force as soon as the soldered connection loses its strength and fails due to overheating. The soldered connection of at least one of the contact arms loses its strength at a lower temperature and is formed from a different alloy than the soldered connection that connects the power semiconductor to the printed circuit board. A method for populating a printed circuit board is also described.

Abstract: There is provided an apparatus for attaching an item to a substrate, using a prong ring with a ring and two or more prongs. When attached, the prongs extends from the ring on a first side of the substrate through such substrate and being bent. A lower die is positioned to approach the first side of the substrate. An upper die is on a second side of the substrate. The substrate is placed in a manner substantially perpendicular to the attaching movement of the upper and lower dies and a first redirecting member for redirecting the prongs which are bent inwardly. The first redirecting member cooperates with an abutting member positioned along the approach of the prong ring towards the first side of the substrate for inhibiting movement of the prong ring towards the substrate while the first redirecting member is used.