Patents by Inventor Markus Wille

Markus Wille has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140022752
    Abstract: Disclosed herein is a circuit board system comprising a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.
    Type: Application
    Filed: August 30, 2012
    Publication date: January 23, 2014
    Inventor: Markus Wille
  • Patent number: 7417523
    Abstract: SMT-components known in the art usually have a thickness of approximately 1 mm and no flexibility. According to the present invention windings for an inductor are realized within a substrate, preferably by using copper layers which are already in the substrate. Then, thin metal sheet layers of high permeable material are laminated on top and bottom of the substrate. These layers are structured and then form the magnetic core of the inductor. Advantageously, an inductor may be provided with a very small building height.
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: August 26, 2008
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Eberhard Waffenschmidt, Bernd Ackermann, Markus Wille