Abstract: A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e1) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e2) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: A method of bonding a first substrate (2u) to a second substrate (2o), the first substrate (2u) having a primary section and the second substrate (2o) having a secondary section, wherein when the first substrate (2u) is bonded to the second substrate (2o), a bond wave (3) advancing along a bonding direction is formed between a first partial portion, in which the first substrate (2u) and the second substrate (2o) are bonded, and a second partial portion, in which the first substrate (2u) and the second substrate (2o) are still to be bonded, wherein preferably a subsection of the second substrate (2o) in the second partial section is vertically offset with respect to a subsection of the second substrate (2o) in the first partial portion in a direction perpendicular to a main extension plane, and wherein for the relative alignment of the primary section and the secondary section with respect to one another, in particular with respect to a direction running essentially parallel to the bonding direction, a

Abstract: A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e1) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e2) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.

Abstract: A method for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: The invention relates to a method and a substrate system for the separation of a carrier substrate from a substrate, in particular a product substrate, by irradiation of the separating layer.

Abstract: The invention relates to a method and a device for the compensation of distortions on a substrate surface of a substrate, a method for bonding two substrates and a product.

Abstract: A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

Abstract: The invention relates to a method and a device for the production and preparation of electronic components

Abstract: A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.

Abstract: A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.

Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Abstract: A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Abstract: A method and device for injection moulding, in particular for micro-injection moulding, at least comprising a mould with a first mould half and a second mould half, wherein the first mould half and the second mould half define an injection moulding space in the closed state of the mould, and an insert arranged in the injection moulding space.