Abstract: The invention relates to a method for calibrating thermal processing equipment used for heat treatment of a multilayer substrate, in particular a multilayer semiconductor substrate. A calibration test profile is determined by processing a calibration test substrate according to thermal process parameters that produce multilayer substrates having an even thickness profile, and/or having reduced slip lines and/or reduced wafer deformation, and/or having other desired and predetermined properties. Then a particular thermal processing equipment is calibrated by determining thermal process parameters for that equipment so that a test substrate processed with these parameters will have the determined calibration test profile.

Abstract: The invention relates to a biochip comprising a substrate presenting a reflecting main surface and wherein the main surface presents localized sites that are made sensitive to fluorescence detection by a transparent layer having optical thickness (2k+1)&lgr;/4 where k is a positive or zero integer and where &lgr; designates a wavelength lying between a wavelength &lgr;0 at which fluorescence is excited and a wavelength &lgr;1 at which fluorescence is emitted. The biochip can be manufactured by depositing a transparent layer of thickness m&lgr;′/2 on a substrate and by making studs or wells of thickness (2k+1)&lgr;/4 in said layer to form said sensitive sites.