Abstract: The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizers in electrolytes for electroless metal deposition. An electrolyte, as well as a method for the electroless deposition of metals is disclosed. The plated metal layers can comprise nickel, copper, cobalt, boron, silver, palladium or gold, as well as alloys comprising at least one of the aforementioned metals as an alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator. A method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention is also disclosed.

Abstract: The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthermore, the invention as described relates to a method of refreshing an electrolyte for the electrochemical deposition of a metal on a substrate.

Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.

Abstract: A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.

Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.

Abstract: Abstract of the Disclosure A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.

Abstract: A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.

Abstract: The present invention relates to a method as well as and electrolyte for the electrolytic deposition of mat or half-glossy copper layers from an acid electrolyte in a pull-through device. The method according to the invention is operated with current densities comprises between 10 and 100 A/dm2 and is suitable for depositing sufficiently thick copper layers in high-speed pull-through devices. The electrolyte according to the invention comprises apart from copper, alkyl sulfonic acid.

Abstract: A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.

Abstract: A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 ?m and about 4.0 ?m in thickness. There is a nickel-phosphorus layer under the tin coating.

Abstract: A method for the selective or complete rendering inert of substrates, workpieces, and components of the apparatus in the chemical deposition of metals by depositing nonreactive coatings thereon. A coating which is nonreactive with respect to the subsequent plating is electrolytically deposited on the sites of the substrate which are not to be plated from a solution containing an activator and an electrolyte. The inert, nonreactive coating is removable by means of dilute acids or alkaline media, without manual effort, after the subsequent chemical plating of the substrates, workpieces, or unit parts.

Abstract: The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.

Abstract: The slightly water-soluble metal salts having the formula I ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and represent hydrogen or a lower alkyl group of from 1 to 3 carbon atoms, M is the cation of a metal which forms slightly water-soluble sulfides, and n means 1 or 2, and mixtures thereof are prepared by reacting carbon disulfide with ketones having the formula II: ##STR2## optionally with the addition of non-aqueous inert solvents, in the presence of strong alkali, preferably potassium hydroxide, followed by precipitation of the slightly water-soluble metal salts of formula I by the addition of aqueous solutions of metal salts of the metals M. They are used as gloss additives to electrolytic baths.