Abstract: A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.

Abstract: A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.

Abstract: A method and system of deflecting air circulated in a data center room are disclosed. A method for controlling air circulation within a room having an aisle between racks with computer systems mounted thereon comprises supplying cooling air to computer systems in the racks via holes in a floor of the room and using a deflector to reduce flow of cooling air along the aisle toward an air intake of a cooling unit without passing the computer systems.

Abstract: A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.

Abstract: A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.

Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Abstract: A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.

Abstract: A method for using interchangeable cartridges for cooling electronic components. One of a first cartridge and a second cartridge is attached to a surface. The first cartridge includes a heat sink and mounting plate, the mounting plate for thermally contacting an integrated circuit. The second cartridge includes a closed-loop fluidic circuit having a pump, heat exchanger and a cold plate, the cold plate for thermally contacting the integrated circuit. The one of the first cartridge and the second cartridge is removed from the surface. The other of the first cartridge and the second cartridge is attached to the surface.

Abstract: A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.

Abstract: A system and method of using refrigerant for cooling electronic components is presented. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop refrigeration circuit is coupled to the surface for removing heat generated by the integrated circuit. The closed-loop refrigeration circuit includes a condenser. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the condenser, wherein the blower moves air across the condenser.