Abstract: An apparatus for applying tape and joint compound to a drywall. The apparatus comprises a pan member having each of a predetermined size and a predetermined shape and formed of a predetermined material for holding a drywall joint compound. A holder means that is engageable with the pan member is designed for holding a roll of drywall tape and there is a slot disposed at a predetermined location on each end of the pan member for permitting the tape to enter a first end of the pan member and exit a second end of the pan member wherein the tape exiting the second end of the pan member is covered on substantially an upper side with such joint compound.