Abstract: In one aspect, forming a stacked strain gauge sensor with increased electrical resistance includes: forming multiple sensor layers, wherein the sensor layers include strain gauge sensor wires on substrates; forming holes in the substrates; stacking the sensor layers, one on top of another, to form a stack with the holes aligned in one or more locations forming through holes in the stack; and forming interconnects in the holes in one or more other locations interconnecting the strain gauges sensor wires between adjacent sensor layers to form a stacked strain gauge sensor. A stacked strain gauge sensor and method of use thereof are also provided.

Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.

Abstract: Stacked strain gauge sensors with increased electrical resistance are provided. In one aspect, a method of forming a stacked strain gauge sensor includes: forming multiple sensor layers, wherein the sensor layers include strain gauge sensor wires on substrates; forming holes in the substrates; stacking the sensor layers, one on top of another, to form a stack with the holes aligned in one or more locations forming through holes in the stack; and forming interconnects in the holes in one or more other locations interconnecting the strain gauges sensor wires between adjacent sensor layers to form a stacked strain gauge sensor. A stacked strain gauge sensor and method of use thereof are also provided.

Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.