Patents by Inventor Marlon C. Daniels

Marlon C. Daniels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shielding member, particularly suitable for shielding of module cages
    Patent number: 9035199
    Abstract: A receptacle assembly includes a hollow conductive cage with a front end and an opening to an interior portion of the cage. The opening is configured to receive a module assembly therein. The cage has a bottom with a bottom opening communicating with the interior portion, and the bottom is configured to be joined to a circuit board. A layered EMI shield member is provided between the bottom of the cage and the circuit board and the shield member extends completely around the bottom opening of the cage. The EMI shield member is formed as a flexible, low-cost assembly that utilizes a pair or insulative layers that flank a conductive layer.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: May 19, 2015
    Assignee: Molex Incorporated
    Inventors: Kenneth F. Janota, Eran J. Jones, Marlon C. Daniels, Michael Alan Johnston
  • EMI SHIELDING MEMBER, PARTICULARLY SUITABLE FOR SHIELDING OF MODULE CAGES
    Publication number: 20130199835
    Abstract: A receptacle assembly includes a hollow conductive cage with a front end and an opening to an interior portion of the cage. The opening is configured to receive a module assembly therein. The cage has a bottom with a bottom opening communicating with the interior portion, and the bottom is configured to be joined to a circuit board. A layered EMI shield member is provided between the bottom of the cage and the circuit board and the shield member extends completely around the bottom opening of the cage. The EMI shield member is formed as a flexible, low-cost assembly that utilizes a pair or insulative layers that flank a conductive layer.
    Type: Application
    Filed: May 19, 2011
    Publication date: August 8, 2013
    Applicant: MOLEX INCORPORATED
    Inventors: Kenneth F. Janota, Eran J. Jones, Marlon C. Daniels, Michael Alan Johnston
  • PC card receptacle with integral ground clips
    Patent number: 5920460
    Abstract: An electronic circuit module having a metal cover is provided for interconnecting with a host device. The module includes an interface whereby electronic signals can be exchanged between the module and the host device. A mechanism for electrically grounding the metal cover to the ground plane of a printed circuit board housed within the module is provided along with a device for connecting the ground plane of the printed circuit board to a signal reference ground potential supplied by the host device. The present invention includes a module frame for attaching the metal cover thereto. A printed circuit board, including a ground plane, is mounted within the frame. A connector having a plurality of contact elements electrically connected to various the circuits disposed on the printed circuit board, including at least one contact element electrically connected to the ground plane is also adapted to fit within the module frame. The connector includes at least one grounding member.
    Type: Grant
    Filed: January 11, 1997
    Date of Patent: July 6, 1999
    Assignee: Methode Electronics, Inc.
    Inventors: John G. Oldendorf, Marlon C. Daniels, Jr., Mark W. Stack