Patents by Inventor Marlon Cardenas

Marlon Cardenas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7360945
    Abstract: A method and apparatus for measuring the temperature of a computer system, such as a notebook computer, is described. A sensor module is to mount within the computer system spaced from an interior surface of a chassis of the system, the sensor to measure an internal surface of a chassis of the system.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: April 22, 2008
    Assignee: Intel Corporation
    Inventors: Jim Kardach, David Williams, Eric Distefano, Marlon Cardenas, Jim Hermerding
  • Publication number: 20060221568
    Abstract: A method and apparatus for measuring the temperature of a computer system, such as a notebook computer, is described. A sensor module is to mount within the computer system spaced from an interior surface of a chassis of the system, the sensor to measure an internal surface of a chassis of the system.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Jim Kardach, David Williams, Eric Distefano, Marlon Cardenas, Jim Hermerding
  • Publication number: 20020114136
    Abstract: A heat sink insertable into a computer and attached to the computer. The heat sink is coupled to a heat pipe. When the heat sink is inserted into the computer, the heat pipe is disengaged from a heat source. When the heat sink is removed from the computer, the heat pipe is engaged with the heat source to transfer heat generated by the heat source to the heat sink, which is external to the computer.
    Type: Application
    Filed: February 20, 2001
    Publication date: August 22, 2002
    Inventor: Marlon Cardenas
  • Patent number: 6437982
    Abstract: A heat sink insertable into a computer and attached to the computer. The heat sink is coupled to a heat pipe. When the heat sink is inserted into the computer, the heat pipe is disengaged from a heat source. When the heat sink is removed from the computer, the heat pipe is engaged with the heat source to transfer heat generated by the heat source to the heat sink, which is external to the computer.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: August 20, 2002
    Assignee: Intel Corporation
    Inventor: Marlon Cardenas