Patents by Inventor Marnie Ann Mattei

Marnie Ann Mattei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flex circuit package and method
    Patent number: 8536462
    Abstract: A flex circuit package includes a package body enclosing an electronic component and a first surface of the substrate. Columns are physically and electrically connected to first traces of the substrate, the columns extending through the package body. A flexible circuit connector has first terminals connected to the columns. The flexible circuit connector further includes second terminals that provide an electrical interconnection structure for electrical connection to a second electronic component structure. By connecting the flexible circuit connector to the columns extending through the package body, special routing of traces of the substrate of the flex circuit package to provide an interface for the flexible circuit connector is avoided.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: September 17, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Robert Francis Darveaux, Ludovico E. Bancod, Marnie Ann Mattei, Timothy Lee Olson