Abstract: A sensor monitoring system and associated methods are provide that preferably include a plurality of sensors connected in parallel across a single pair of wires that include resistances of equal value placed in series between each sensor. This allows each sensor to measure the voltage dropped between itself and the monitoring system to determine its relative placement on the bus to autonomously assign itself a number to delineate to the monitoring system its relative location on the equipment or item being monitored. The sensors modulate their internal resistance to change the current on the bus to transmit their status to the monitoring system.

Abstract: A sensing apparatus having a sensor and signal conditioner angled relative to each other at a predetermined angle and formed in a seamless monolithic semiconductor substrate is provided. The sensor is formed in the cut plane of the seamless monolithic semiconductor substrate. The signal conditioner is formed in a wafer surface of the same seamless monolithic semiconductor substrate. The sensor generates a sensing signal in response to a preselected physical stimulus. The signal conditioner is electrically connected to the sensor to condition the signal generated. The seamless monolithic semiconductor substrate can be mounted on a mounting base and encapsulated in an encapsulation to provide a protective cover. An additional conductor connected to the signal conditioner and extending outwardly from the encapsulation connects the sensing apparatus to a remote electrical device such as a sensing monitor.

Abstract: A method for forming a sensing apparatus having a sensor and signal conditioner angled relative to each other at a predetermined angle and formed in a seamless monolithic semiconductor substrate is provided. The sensor and the signal conditioner are formed on distinct surface portions of a single seamless monolithic semiconductor substrate. The sensor, moreover, can be formed in the cut plane of the seamless monolithic semiconductor substrate. The signal conditioner correspondingly can be formed in a wafer surface of the same seamless monolithic semiconductor substrate. The seamless monolithic semiconductor substrate further can be mounted on a mounting base and at least the signal conditioner encapsulated in an encapsulation to provide a protective cover. An additional conductor connected to the signal conditioner and extending outwardly from the encapsulation can connect the sensing apparatus to a remote electrical device such as a sensing monitor.

Abstract: A sensing apparatus having a sensor formed in a monolithic semiconductor substrate and oriented orthogonally to a signal conditioner is provided. The sensor generates a sensing signal in response to a predetermined physical stimulus. A signal conditioner electrically connected and responsive to the sensor conditions the sensing signal. The signal conditioner, moreover, is preferably formed in the same semiconductor substrate and, more preferably is oriented at a right angle relative so as to be orthogonal to the sensor to thereby enhance the compactness of the sensing apparatus.

Abstract: A sensing apparatus having a sensor formed in a monolithic semiconductor substrate and oriented orthogonally to a signal conditioner is provided. The sensor generates a sensing signal in response to a predetermined physical stimulus. A signal conditioner electrically connected and responsive to the sensor conditions the sensing signal. The sensor and signal conditioner are formed on wafer surfaces of a single semiconductor substrate cut from a semiconductor wafer. The substrate is separated, one portion having the sensor formed on therein and the other having formed therein the signal conditioner. The portions are oriented and rejoined to form a monolithic semiconductor substrate. The resulting monolithic substrate has, then, a sensor and signal conditioner formed therein and angled relative to each other at a predetermined angle.

Abstract: A compact sensing apparatus having reduced cross section and methods are provided for sensing the magnitude and direction of an electrical or magnetic field. The compact sensing apparatus and method preferably provide one of two transducer orientations in relation to the direction of the field arranged in the sensor apparatus to provide the smallest possible cross section. The compact sensing apparatus preferably includes a plurality of mounting pins. Each of the plurality of mounting pins preferably is formed of a magnetic material and includes a first pin portion and a second pin portion connected to the first pin portion at a predetermined angle. The predetermined angle is preferably less than 180 degrees and more preferably in the range of about 70-110 degrees.