Abstract: A low leakage current monolithic InGaAs InP discrete device is provided for a focal plane array for near-infrared imaging. The array consists of a plurality of InGaAs p-i-n diodes for photodetectors, with each being integrated on a common substrate with an Inp junction field effect transistor (JFET) as a switching element for each pixel. In order to minimize the drain and gate leakage to achieve high-detection sensitivity, a p-encapsulation of an n-drained of each JFET is employed.

Abstract: A protected solar cell including a monolithic bypass diode is formed by adding an additional layer of semiconductive material having a type opposite to the outermost semiconductive layer of a solar cell, and the resultant additional layer is cut back to form a small area bypass diode, which is subsequently connected across the solar cell by integrated circuit metallization techniques. The solar cell may be formed of gallium arsenide with the underlying semiconductive material being n-type gallium arsenide, and forming a junction with a thin layer of p-type gallium arsenide covered with a window of p-type aluminum gallium arsenide. The bypass diode is initially formed of a supplemental layer of n-type gallium arsenide, and by sucessive etching processes, an island is formed extending downward from a small area of n-type gallium arsenide through the two p-type layers.

Abstract: A photovoltaic cell structure is fabricated from an active medium including an undoped, intrinsically p-type organic semiconductor comprising polyacetylene. When a film of such material is in rectifying contact with a magnesium electrode, a Schottky-barrier junction is obtained within the body of the cell structure. Also, a gold overlayer passivates the magnesium layer on the undoped polyacetylene film.

Abstract: A solar cell is constructed by coating an n-type conductivity semiconductor with a thin layer of bromine doped, polymeric sulfur-nitride, (SNBr.sub.0.4).sub.x. Metal deposits are provided on both materials for making electrical contact to the cell. In a preferred embodiment, the semiconductor is silicon. In a second preferred embodiment, the semiconductor is GaAs on an n.sup.+ -type conductivity GaAs substrate.

Abstract: A composite polymeric material having metallic surface properties is prepared by subliming solid crystalline polymeric sulfur nitride to a vapor, and thereafter condensing the polymeric sulfur nitride vapor onto the surface of a highly-oriented thermoplastic polymeric substrate to thereby form on the substrate an epitaxial crystalline polymeric sulfur nitride film. The polymeric sulfur nitride film is completely oriented parallel to the direction of orientation of the substrate and has a relatively high degree of anisotropy with respect to its electrical conductivity and optical properties.