Abstract: A transducer comprising a transducer element including a plate with a through-hole and a collar projecting from the plate and defining an interior cavity in communication with the through-hole. A piezoelectric bender includes at least first and second wafer layers stacked together. The bender is coupled to a peripheral end face of the collar. The first and/or second piezoelectric wafer layers bend at a resonant frequency and generate ultrasonic waves that flow through the collar interior cavity and the plate through-hole and create an in-air pressure pattern and acoustic field at a location spaced from the transducer. A plurality of transducers may be made by providing a monolithic transducer element structure including a plurality of the transducer elements formed thereon, coupling either a plurality of benders or a monolithic bender to the plurality of transducer elements, and then cutting the monolithic transducer element structure to define a plurality of individual transducers.

Abstract: A transducer comprising a transducer element including a plate with a through-hole and a collar projecting from the plate and defining an interior cavity in communication with the through-hole. A piezoelectric bender includes at least first and second wafer layers stacked together. The bender is coupled to a peripheral end face of the collar. The first and/or second piezoelectric wafer layers bend at a resonant frequency and generate ultrasonic waves that flow through the collar interior cavity and the plate through-hole and create an in-air pressure pattern and acoustic field at a location spaced from the transducer. A plurality of transducers may be made by providing a monolithic transducer element structure including a plurality of the transducer elements formed thereon, coupling either a plurality of benders or a monolithic bender to the plurality of transducer elements, and then cutting the monolithic transducer element structure to define a plurality of individual transducers.

Abstract: A composite ceramic structure such as, for example, a PZT ceramic structure including, in one embodiment, a plurality of ceramic elements encapsulated in a layer of epoxy material. Each of the ceramic elements includes opposed first and second ends terminating in opposed respective top and bottom surfaces of the composite ceramic structure. A layer of conductive material on the top surface of the composite ceramic structure covers only the respective first ends of the ceramic elements to isolate the same from each other. A layer of conductive material covers the entire bottom surface of the composite ceramic structure to ground the opposed second ends of the plurality of ceramic elements to each other. A method of making the composite ceramic structure described above is also disclosed.

Abstract: An assembly for retaining a board such as a printed circuit board in the groove of a plate such as a cold plate. The retaining assembly includes an elongate open bracket or sleeve defining an interior channel which houses an elongate rod and an elongate cradle for the rod. In one embodiment, the cradle is defined by a separate beam which is seated in the channel and the open bracket is a generally U-shaped unitary strip of material which includes a flexible wall which is deflected outwardly in response to rotation of the rod into engagement with an interior wall of the cold plate for locking the board in the groove of the cold plate. The open bracket also includes a securement wall opposite the flexible wall which, in one embodiment, is secured to the cold plate.

Abstract: A composite ceramic structure such as, for example, a PZT ceramic structure including, in one embodiment, a plurality of ceramic elements encapsulated in a layer of epoxy material. Each of the ceramic elements includes opposed first and second ends terminating in opposed respective top and bottom surfaces of the composite ceramic structure. A layer of conductive material on the top surface of the composite ceramic structure covers only the respective first ends of the ceramic elements to isolate the same from each other. A layer of conductive material covers the entire bottom surface of the composite ceramic structure to ground the opposed second ends of the plurality of ceramic elements to each other. A method of making the composite ceramic structure described above is also disclosed.

Abstract: An assembly for retaining a board such as a printed circuit board in the groove of a plate such as a cold plate. The retaining assembly includes an elongate open bracket or sleeve defining an interior channel which houses an elongate rod and an elongate cradle for the rod. In one embodiment, the cradle is defined by a separate beam which is seated in the channel and the open bracket is a generally U-shaped unitary strip of material which includes a flexible wall which is deflected outwardly in response to rotation of the rod into engagement with an interior wall of the cold plate for locking the board in the groove of the cold plate. The open bracket also includes a securement wall opposite the flexible wall which, in one embodiment, is secured to the cold plate.