Patents by Inventor Marta ALOMAR DOMINGUEZ

Marta ALOMAR DOMINGUEZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230361009
    Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a package body and a second die pad at least partially encapsulated in the package body. A first semiconductor die is at least partially encapsulated in the package body and arranged on the first die pad. A further device at least partially encapsulated in the package body and arranged on the second die pad. At least one first lead is connected with the first contact pad of the first semiconductor die. At least one second lead is connected with the second contact pad of the further device. An electrical conductor is connected between the at least one first lead and the at least one second lead, the electrical conductor being completely encapsulated in the package body.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 9, 2023
    Applicant: Infineon Technologies AG
    Inventors: Lee Shuang WANG, Marta ALOMAR DOMINGUEZ, Marcus BÖHM, Edward FÜRGUT, Chii Shang HONG, Teck Sim LEE, Bernd SCHMOELZER