Abstract: The present disclosure provides compositions of matter, methods, systems, and instruments for improved nucleic acid-guided nuclease editing in live cells, wherein the live cells are shifted into a growth-arrested state for editing.

Abstract: A soft body armor arrangement has a plurality of layers of soft ballistic material stacked on one another, each layer comprising a plurality of sub-layers of ballistic material. Each of the layers has a respective seam line attaching two or more respective sections of the layer. The sizes of the section are varied so that the resultant seam lines of adjacent layers are offset and spaced apart from one another, but the overall size and shape of each layer is the same. This avoids stacking and bunching of the seam lines which can cause rigidity and discomfort.

Abstract: An acoustic resonator, comprises a substrate and a first passivation layer disposed over the substrate. The first passivation layer comprises a first layer of silicon carbide (SiC). The acoustic resonator further comprises a first electrode disposed over the passivation layer, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator comprises a second passivation layer disposed over the second electrode. The second passivation layer comprises a second layer of silicon carbide (SiC).

Abstract: A method for detecting and reporting changes in functional features of a simulation model caused by a software revision is disclosed. In one aspect, the method is independent of simulation model architecture. One performs regression testing with a plurality of feature-specific modules. The feature-specific modules are configured to generate a first set of information with the simulation model and compare the first set of information to a second set of corresponding information from the simulation model. In the above-described testing, the first set of information postdates the software revision and the second set of information predates the software revision.

Abstract: An apparatus is for maintaining the head of a person in an erect position when the person is sitting in a seat. The apparatus includes a clamp connected to the seat. A flexible rod is provided. A mechanism is for coupling an end of the flexible rod to the clamp. The flexible rod can be bent to extend across the forehead of the head of the person, to keep the head in the erect position especially when the person is sleeping.

Abstract: An acoustic resonator, comprises a substrate and a first passivation layer disposed over the substrate. The first passivation layer comprises a first layer of silicon carbide (SiC). The acoustic resonator further comprises a first electrode disposed over the passivation layer, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator comprises a second passivation layer disposed over the second electrode. The second passivation layer comprises a second layer of silicon carbide (SiC).

Abstract: A method for detecting and reporting changes in functional features of a simulation model caused by a software revision is disclosed. In one aspect, the method is independent of simulation model architecture. One performs regression testing with a plurality of feature-specific modules. The feature-specific modules are configured to generate a first set of information with the simulation model and compare the first set of information to a second set of corresponding information from the simulation model. In the above-described testing, the first set of information postdates the software revision and the second set of information predates the software revision.

Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Abstract: In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.

Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Abstract: A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective layer over the angled sidewall forms a mirror for reflecting a light. The lid further includes a solder layer atop another portion of the reflective layer over the bond area, and a barrier layer atop the mirror. The barrier layer is solder non-wettable so it prevents the solder layer from wicking into the cavity and interfering with the mirror. The barrier layer is also transparent to the light and has a thickness that either does not affect the light reflection or improves the light reflection.

Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

Abstract: An integrated polysilicon fuse and diode and methods of making the same are provided. The integrated polysilicon fuse and diode combination may be implemented in a programmable cross point fuse array. The integrated polysilicon fuse and diode may be used in a random access memory (RAM) cell. The polysilicon diode may be isolated from a substrate and other devices, use less area on a substrate, and cost less to manufacture compared to other diodes.

Abstract: An air freshener holding device for evenly dispensing a fragrance throughout an entire room each time a fan unit is turned on. The air freshener holding device includes a container having a front wall, a back wall, a bottom wall, side walls, an open top, and a storage compartment being disposed therein and being adapted to removably retain cakes of deodorant; and also includes fastening members being attached to the container and being adapted to attach the container to a fan vent cover.