Patents by Inventor Martial Desgeorges

Martial Desgeorges has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for encapsulating microstructures
    Patent number: 8617413
    Abstract: A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate (12), of at least one cover (7) supported by a mould (1, 2, 6), the mould including a catching layer (6), each cover (7) being in contact with the catching layer (6); then fastening of at least one cover (7) onto the carrier substrate (12); and then separation of the mould (1, 2, 6) from the at least one cover (7). The catching layer (6) includes a fluoropolymer. Preferably, the mould (1, 2, 6) is mechanically separated from the at least one cover (7), by pulling the mould (1, 2, 6) away from the at least one cover (7). Thus, the mould (1) can be reused, which considerably simplifies encapsulating operations carried out on an industrial scale.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: December 31, 2013
    Assignee: KFM Technology
    Inventors: Sebastien Brault, Elisabeth Dufour-Gergam, Martial Desgeorges
  • METHOD AND DEVICE FOR ENCAPSULATING MICROSTRUCTURES
    Publication number: 20110165365
    Abstract: A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate (12), of at least one cover (7) supported by a mould (1, 2, 6), the mould including a catching layer (6), each cover (7) being in contact with the catching layer (6); then fastening of at least one cover (7) onto the carrier substrate (12); and then separation of the mould (1, 2, 6) from the at least one cover (7). The catching layer (6) includes a fluoropolymer. Preferably, the mould (1, 2, 6) is mechanically separated from the at least one cover (7), by pulling the mould (1, 2, 6) away from the at least one cover (7). Thus, the mould (1) can be reused, which considerably simplifies encapsulating operations carried out on an industrial scale.
    Type: Application
    Filed: July 31, 2009
    Publication date: July 7, 2011
    Applicant: KFM TECHNOLOGY
    Inventors: Sebastien Brault, Elisabeth Dufour-Gergam, Martial Desgeorges