Abstract: Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser.

Abstract: A header assembly for extended temperature optical transmitters is disclosed. The header assembly may include a hermetic enclosure and a header base with an interior surface. A plurality of conductive leads penetrate from the outer portion of the header assembly to the interior surface. A thermoelectric cooler (“TEC”) having a planar configuration and a thickness not exceeding 500 microns is positioned adjacent to the interior surface of the header assembly, the TEC being in thermal communication with the header base and a mounting surface. A submount, on which a laser diode is positioned, is in thermal communication with the mounting surface of the TEC. In this manner, the TEC may be configured affect a selective transfer of heat to the laser diode and transfer of heat away from the laser diode. In some embodiments, the header assembly is configured to operate at optical data transmission rates of 10 Gbps or higher in such extended ambient temperatures.

Abstract: A header assembly for extended temperature optical transmitters is disclosed. The header assembly may include a hermetic enclosure and a header base with an interior surface. A plurality of conductive leads penetrate from the outer portion of the header assembly to the interior surface. A thermoelectric cooler (“TEC”) having a planar configuration and a thickness not exceeding 500 microns is positioned adjacent to the interior surface of the header assembly, the TEC being in thermal communication with the header base and a mounting surface. A submount, on which a laser diode is positioned, is in thermal communication with the mounting surface of the TEC. In this manner, the TEC may be configured affect a selective transfer of heat to the laser diode and transfer of heat away from the laser diode. In some embodiments, the header assembly is configured to operate at optical data transmission rates of 10 Gbps or higher in such extended ambient temperatures.

Abstract: Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser.