Patents by Inventor Martin Bayes

Martin Bayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050261152
    Abstract: A composition composed of a persulfate, boric acid, a fluorine containing acid and an inorganic acid. Adjuvants also may be included in the composition. The composition may be employed as a microetch solution in the fabrication of microelectronic packages.
    Type: Application
    Filed: July 28, 2005
    Publication date: November 24, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: John Carter, Jack Fellman, Jacek Knop, Martin Bayes
  • Patent number: 6054061
    Abstract: A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: April 25, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin Bayes, Peter W. Hinkley
  • Patent number: 5108786
    Abstract: A method for making printed circuit boards wherein the resistance of catalyzed nonconductive surfaces to solutions used in the processing stages, e.g., KOH used to remove an etch resist covering through-holes and the desired circuit lines, is enhanced by treating the catalyzed surface with an accelerator to activate the catalyst, treating the accelerated surface with a reducing agent, followed by baking.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: April 28, 1992
    Assignee: Enthone-OMI, Inc.
    Inventor: Martin Bayes