Patents by Inventor Martin Beaumier
Martin Beaumier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10141236Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: July 20, 2017Date of Patent: November 27, 2018Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
-
Patent number: 10043725Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: July 20, 2017Date of Patent: August 7, 2018Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
-
Publication number: 20180090407Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: ApplicationFiled: July 20, 2017Publication date: March 29, 2018Applicant: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
-
Publication number: 20180090406Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: ApplicationFiled: July 20, 2017Publication date: March 29, 2018Applicant: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
-
Patent number: 9786572Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: September 23, 2016Date of Patent: October 10, 2017Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Michael Gaynes, Edward J. Yarmchuk
-
Patent number: 9219051Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.Type: GrantFiled: June 5, 2013Date of Patent: December 22, 2015Assignee: GLOBALFOUNDRIES INC.Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet
-
Patent number: 9042120Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: GrantFiled: October 1, 2013Date of Patent: May 26, 2015Assignee: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
-
Publication number: 20140359996Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.Type: ApplicationFiled: June 5, 2013Publication date: December 11, 2014Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet
-
Publication number: 20140016283Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: ApplicationFiled: October 1, 2013Publication date: January 16, 2014Applicant: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
-
Patent number: 8614900Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: GrantFiled: May 18, 2011Date of Patent: December 24, 2013Assignee: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
-
Publication number: 20110292621Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: ApplicationFiled: May 18, 2011Publication date: December 1, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
-
Patent number: 7733655Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.Type: GrantFiled: July 22, 2008Date of Patent: June 8, 2010Assignee: International Business Machines CorporationInventors: Martin Beaumier, Mohamed Belazzouz, Peter J Brofman, David L Edwards, Kamal K Sikka, Jiantao Zheng, Jeffrey A Zitz
-
Publication number: 20100020503Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.Type: ApplicationFiled: July 22, 2008Publication date: January 28, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: MARTIN BEAUMIER, MOHAMED BELAZZOUZ, PETER J. BROFMAN, DAVID L. EDWARDS, KAMAL K. SIKKA, JIANTAO ZHENG, JEFFREY A. ZITZ