Patents by Inventor Martin Benisek

Martin Benisek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210127490
    Abstract: A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a power device embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the power device and configured to distribute a load current switched by the power device. A fourth metal layer is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 29, 2021
    Inventors: Petteri Palm, Martin Benisek, Liu Chen, Frank Daeche, Josef Maerz
  • Publication number: 20070019494
    Abstract: A semiconductor memory module comprises a control chip that drives various memory chips on a circuit board. The memory chips are connected to the control chip via a control clock bus in a loop fly-by topology. The memory chips are arranged on the module circuit board in such a way that memory chips of different ranks are in connected to the control clock bus alongside one another. A data clock bus for carrying a data clock signal connects a memory chip of different ranks to the control chip in each case in accordance with a point-to-point topology. The semiconductor memory module enables the propagation time of a control clock signal on the control clock bus to be adapted to the propagation time of the data clock signal on the data clock bus.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 25, 2007
    Inventors: Karl-Heinz Moosrainer, Martin Benisek, Srdjan Djordjevic
  • Patent number: 6850414
    Abstract: An electronic printed circuit board has a memory module and a contact strip for insertion into another electronic unit. The memory module has at least nine identically designed housing-encapsulated integrated semiconductor memories configured on the printed circuit board. The longer dimension of the housing of one of the semiconductor memories, which is connected as an error correction chip, is oriented perpendicular to the contact strip. The longer dimension of the housings of the other semiconductor memories are oriented parallel to the contact strip. The different orientation of the semiconductor memories makes it possible to reduce the height of the printed circuit board while enabling the rectangular housings to keep the same physical form.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: February 1, 2005
    Assignee: Infineon Technologies AG
    Inventors: Martin Benisek, Martin Schober
  • Patent number: 6839241
    Abstract: A circuit module comprises a circuit board having a plurality of contact elements along a longitudinal edge thereof. The circuit board has arranged thereon a SDRAM memory component, the connections of this SDRAM memory component being each connected via resistance elements, which are implemented as individual resistors, to one of the contact elements through lines of limited length. The individual resistors are arranged in a line which extends parallel to the longitudinal direction of the circuit board.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: January 4, 2005
    Assignee: Infineon Technologies AG
    Inventors: Martin Benisek, Wolfgang Hoppe, Martin Schober
  • Publication number: 20030002262
    Abstract: An electronic printed circuit board has a memory module and a contact strip for insertion into another electronic unit. The memory module has at least nine identically designed housing-encapsulated integrated semiconductor memories configured on the printed circuit board. The longer dimension of the housing of one of the semiconductor memories, which is connected as an error correction chip, is oriented perpendicular to the contact strip. The longer dimension of the housings of the other semiconductor memories are oriented parallel to the contact strip. The different orientation of the semiconductor memories makes it possible to reduce the height of the printed circuit board while enabling the rectangular housings to keep the same physical form.
    Type: Application
    Filed: July 2, 2002
    Publication date: January 2, 2003
    Inventors: Martin Benisek, Martin Schober
  • Publication number: 20020167803
    Abstract: A circuit module comprises a circuit board having a plurality of contact elements along a longitudinal edge thereof. The circuit board has arranged thereon a SDRAM memory component, the connections of this SDRAM memory component being each connected via resistance elements, which are implemented as individual resistors, to one of the contact elements through lines of limited length. The individual resistors are arranged in a line which extends parallel to the longitudinal direction of the circuit board.
    Type: Application
    Filed: May 10, 2002
    Publication date: November 14, 2002
    Inventors: Martin Benisek, Wolfgang Hoppe, Martin Schober