Patents by Inventor Martin Bergsmann

Martin Bergsmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6896938
    Abstract: A partially vapor-deposited metallized film is disclosed including a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times and also a method for producing a partially vapor-deposited metallized film, a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times, wherein either a structure is printed onto a substrate or onto a supporting film with a soluble ink (washable ink) or the base materials are directly cleaned in a vacuum by means of plasma processing and are simultaneously initiated with target atoms, and wherein a metal or the like is vapor-deposited thereon followed by a production of the structured layer, for multiple uses, for example, in securities, as a radio frequency antenna for transponders and the like.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: May 24, 2005
    Assignee: Hueck Folien Gesellschaft m.b.H.
    Inventors: Friedrich Kastner, Martin Bergsmann, Johann Hillburger, Ronald Einsiedler, Roland Treutlein
  • Publication number: 20030175545
    Abstract: A partially vapor-deposited metallized film is disclosed including a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times and also a method for producing a partially vapor-deposited metallized film, a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times, wherein either a structure is printed onto a substrate or onto a supporting film with a soluble ink (washable ink) or the base materials are directly cleaned in a vacuum by means of plasma processing and are simultaneously initiated with target atoms, and wherein a metal or the like is vapor-deposited thereon followed by a production of the structured layer, for multiple uses, for example, in securities, as a radio frequency antenna for transponders and the like.
    Type: Application
    Filed: April 3, 2003
    Publication date: September 18, 2003
    Applicant: HUECK Folien Gesellschaft m.b.H.
    Inventors: Friedrich Kastner, Martin Bergsmann, Johann Hillburger, Ronald Einsiedler, Roland Treutlein