Patents by Inventor Martin BLEIFUSS

Martin BLEIFUSS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250198853
    Abstract: A temperature sensor having an insulating polymer substrate, at least two connection lines and at least one resistance sensor element, the at least two connection lines being arranged on the polymer substrate, the at least one resistance sensor element being connected to the connection lines and the at least one resistance sensor element and the connection lines being covered at least partially by a cover layer having a flexible polymer. The Further included are a plug-in connection element having the temperature sensor and an automated method for producing the plug-in connection element.
    Type: Application
    Filed: February 15, 2015
    Publication date: June 19, 2025
    Inventors: Mario Sattler, Matthias Muziol, Martin Bleifuss, Bastian Schwappach, Hengshi Xiang, Christoph Nick
  • Publication number: 20230318207
    Abstract: The invention relates to an electrical element having at least one functional region and a contact surface, wherein a connecting element is arranged on the contact surface, wherein the connecting element comprises a stranded wire coated with sintered material, wherein the stranded wire is connected, in particular sintered, to the contact surface by a sintered material. Furthermore, the invention relates to a method for producing the electrical element according to the invention.
    Type: Application
    Filed: June 14, 2021
    Publication date: October 5, 2023
    Inventors: Matthias MUZIOL, Martin BLEIFUß
  • Publication number: 20230113930
    Abstract: A temperature-sensor assembly comprising at least one temperature sensor and at least one supply line, wherein the temperature sensor has at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side, wherein the supply line has at least one supply-line contact surface, wherein the supply-line contact surface is connected to the sensor-contact surface at least in part by means of a first sinter layer.
    Type: Application
    Filed: February 9, 2021
    Publication date: April 13, 2023
    Inventors: Martin BLEIFUß, Stephan URFELS, Karlheinz WIENAND
  • Publication number: 20220193824
    Abstract: One aspect relates to a 3D connector structure for electrically connecting at least one flat electrode to at least one connection wire. The 3D connector structure has at least two connectors which are spatially separate from one another. The connectors in each case have an electrically conductive material, a first side and a second side. The second side of each connector is connected to an electrical connection element. A spacing of at least 100 ?m is constructed between the first side and the second side of each connector.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 23, 2022
    Applicant: Heraeus Nexensos GmbH
    Inventors: Matthias MUZIOL, Martin BLEIFUSS, Karlheinz WIENAND, Jakob FISCHER, Yasin KILIC BEYTULLAH
  • Patent number: 11268864
    Abstract: A sensor unit for detecting a spatial temperature profile, having at least one substrate with a first surface and a second surface situated at least regionally opposite the first surface. The substrate is configured at least regionally to be flexible. At least one adhesion means is arranged at least regionally on the first surface and/or on the second surface for attaching the sensor unit to at least one measurement body. At least one sensor field is arranged on the second surface of the substrate. One aspect also relates to a method for producing a sensor unit.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: March 8, 2022
    Assignee: Heraeus Nexensos GmbH
    Inventors: Karlheinz Wienand, Stefan Dietmann, Kai-Ulrich Boldt, Dieter Teusch, Martin Bleifuss, Uwe Hellmann, Matthias Muziol
  • Publication number: 20200240848
    Abstract: A sensor unit for detecting a spatial temperature profile, having at least one substrate with a first surface and a second surface situated at least regionally opposite the first surface. The substrate is configured at least regionally to be flexible. At least one adhesion means is arranged at least regionally on the first surface and/or on the second surface for attaching the sensor unit to at least one measurement body. At least one sensor field is arranged on the second surface of the substrate. One aspect also relates to a method for producing a sensor unit.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 30, 2020
    Applicant: Heraeus Nexensos GmbH
    Inventors: Karlheinz Wienand, Stefan Dietmann, Kai-Ulrich Boldt, Dieter Teusch, Martin Bleifuss, Uwe Hellmann, Matthias Muziol
  • Patent number: 10347566
    Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 9, 2019
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Michael Benedikt, Thomas Krebs, Michael Schäfer, Wolfgang Schmitt, Andreas Hinrich, Andreas Klein, Alexander Brand, Martin Bleifuss
  • Publication number: 20170117209
    Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the carrier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
    Type: Application
    Filed: March 26, 2015
    Publication date: April 27, 2017
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Michael BENEDIKT, Thomas KREBS, Michael SCHÄFER, Wolfgang SCHMITT, Andreas HINRICH, Andreas KLEIN, Alexander BRAND, Martin BLEIFUSS