Abstract: A novel silicon micromirror structure for improving image fidelity in laser pattern generators is presented. In some embodiments, the micromirror is formed from monocrystalline silicon. Analytical- and finite element analysis of the structure as well as an outline of a fabrication scheme to realize the structure are given. The spring constant of the micromirror structure can be designed independently of the stiffness of the mirror-surface. This makes it possible to design a mirror with very good planarity, resistance to sagging during actuation, and it reduces influence from stress in reflectivity-increasing multilayer coatings.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: A novel silicon micromirror structure for improving image fidelity in laser pattern generators is presented. In some embodiments, the micromirror is formed from monocrystalline silicon. Analytical—and finite element analysis of the structure as well as an outline of a fabrication scheme to realize the structure are given. The spring constant of the micromirror structure can be designed independently of the stiffness of the mirror-surface. This makes it possible to design a mirror with very good planarity, resistance to sagging during actuation, and it reduces influence from stress in reflectivity-increasing multilayer coatings.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.