Patents by Inventor Martin Cereding Roberts

Martin Cereding Roberts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming conductive interconnects
    Publication number: 20040166622
    Abstract: The invention includes a method of forming a conductive interconnect. An electrical node location is defined to be supported by a silicon-containing substrate. A silicide is formed in contact with the electrical node location. The silicide is formed by exposing the substrate to hydrogen, TiCl4 and plasma conditions to cause Ti from the TiCl4 to combine with silicon of the substrate to form TiSix. Conductively doped silicon material is formed over the silicide. The conductively doped silicon material is exposed to one or more temperatures of at least about 800° C. The silicide is also exposed to the temperatures of at least about 800° C.
    Type: Application
    Filed: March 2, 2004
    Publication date: August 26, 2004
    Inventors: Gurtej S. Sandhu, Trung Tri Doan, Howard E. Rhodes, Sujit Sharan, Philip J. Ireland, Martin Cereding Roberts