Abstract: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

Abstract: A computer system includes a plurality of blade servers, a midplane, a supplemental midplane, and a peripheral device separate from the blade servers. The midplane includes a plurality of connectors connecting the midplane to the plurality of blade servers. The supplemental midplane is separate from the midplane and includes a body, a plurality of connectors, and a peripheral connector. The plurality of connectors are attached to the body and connect the supplemental midplane to the plurality of blade servers. The peripheral connector is attached to the body and connects the supplemental midplane to the peripheral device. The plurality of connectors of the supplemental midplane communicate with the peripheral connector of the supplemental midplane. The plurality of connectors of the supplemental midplane are configured to be removably connectable to the midplane.

Abstract: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

Abstract: A fan assembly formed of a fan, at least one fan grill comprising a face panel and at least one side panel comprising a spring slot the fan grill coupled to the fan, and a spring coupled to the fan grill the spring comprising a spring driver end extending through the spring slot.

Abstract: A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.

Abstract: A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.

Abstract: The invention provides an apparatus, system, and method for enabling the installation of an installable device configured with a required component in a receiving device. A component deactivated interlock obstructs the installation of the installable device when not configured with the required component. The invention makes use of an extendable and retractable plunger disposed upon the installable device, a stop barrier disposed upon the receiving device, and an actuator disposed upon the required component. The plunger normally extends beyond the installable device, and upon contacting the stop barrier of the receiving device obstructs the installation. Upon a physical connection of the required component with the installable device, the actuator retracts the plunger, thereby enabling the installation of the installable device.

Abstract: An automatic recirculation airflow damper for use in electronic enclosures utilizing multiple air moving devices to cool electronic components within the enclosure. When an air moving device is removed, the damper automatically closes an orifice associated with the absent air moving device, thus preventing the loss of cooling air from the vacated orifice and the subsequent reduction in cooling capacity. In some embodiments, the damper is attached to the enclosure with hinges. In certain embodiments, the damper is configured with elastomeric material such that the interface between the orifice and the damper offers high impedance to airflow while the damper is in a closed position. The automatic recirculation airflow damper reduces electronic thermal failures and therefore increases the reliability of a system equipped with the device.