Patents by Inventor Martin Ding

Martin Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor assembly
    Patent number: 11616019
    Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: March 28, 2023
    Assignee: NVIDIA Corp.
    Inventors: Jacky Qiu, Martin Ding, Jerry Zhou, Minto Zheng
  • Semiconductor Assembly
    Publication number: 20220199528
    Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Inventors: Jacky Qiu, Martin Ding, Jerry Zhou, Minto Zheng