Abstract: A thermoform packaging machine comprising a forming station for thermoforming troughs in a bottom film web adapted to be conveyed in the thermoform packaging machine in a conveying direction, as well as a closing station for closing the troughs with a cover film. The machine further comprises a machine frame that includes a plurality of interconnected vertical members, longitudinal members, cross members, and machine feet. At least one substantially U-shaped or O-shaped portal is rigidly integrated in the machine frame, the portal comprising two columns and a crossbar extending between the two columns and above a conveying plane of the bottom film web transversely to the conveying direction, wherein the portal has a 2-axis robot mounted thereon.

Abstract: The present invention relates to a thermoform packaging machine and a method of operating a thermoform packaging machine, which comprises an infeed station and a pre-sealing station, so as to feed elongate products into troughs and retain them therein until a cover film has been fixed so as to cover the troughs.

Abstract: The invention relates to a thermo-forming packaging machine comprising a product feeder for feeding a product to a loading stretch of the packaging machine, and a film web having trays formed therein wherein the trays are configured to receive a product. The product feeder may be arranged at least partially parallel to the loading stretch of the packaging machine. The thermo-forming packaging machine also includes a side panel disposed along the loading stretch that is formed such that it also forms part of the product feeder.

Abstract: A thermoform packaging machine comprising a forming station for thermoforming troughs in a bottom film web adapted to be conveyed in the thermoform packaging machine in a conveying direction, as well as a closing station for closing the troughs with a cover film. The machine further comprises a machine frame that includes a plurality of interconnected vertical members, longitudinal members, cross members, and machine feet. At least one substantially U-shaped or O-shaped portal is rigidly integrated in the machine frame, the portal comprising two columns and a crossbar extending between the two columns and above a conveying plane of the bottom film web transversely to the conveying direction, wherein the portal has a 2-axis robot mounted thereon.

Abstract: The invention relates to a thermo-forming packaging machine comprising a product feeder for feeding a product to a loading stretch of the packaging machine, and a film web having trays formed therein wherein the trays are configured to receive a product. The product feeder may be arranged at least partially parallel to the loading stretch of the packaging machine. The thermo-forming packaging machine also includes a side panel disposed along the loading stretch that is formed such that it also forms part of the product feeder.

Abstract: The present invention relates to a thermoform packaging machine and a method of operating a thermoform packaging machine, which comprises an infeed station and a pre-sealing station, so as to feed elongate products into troughs and retain them therein until a cover film has been fixed so as to cover the troughs.

Abstract: A suction gripper arrangement includes several suction gripper arms arranged in a row, which, at their lower ends, each have a suction gripper head with an abutment surface for abutting an article to be sucked onto the suction gripper head. The abutment surfaces of the suction gripper heads of the suction gripper arms neighboring each other are arranged in different planes. Moreover, the invention relates to a suction gripper arrangement in which at least one of the suction gripper arms is connected to an actuator via a lever, wherein both between the lever and the suction gripper arm, and also between the lever and the actuator, respectively, a pivot joint is formed, and wherein the lever is composed of at least to lever parts.

Abstract: A suction gripper arrangement includes several suction gripper arms arranged in a row, which, at their lower ends, each have a suction gripper head with an abutment surface for abutting an article to be sucked onto the suction gripper head. The abutment surfaces of the suction gripper heads of the suction gripper arms neighboring each other are arranged in different planes. Moreover, the invention relates to a suction gripper arrangement in which at least one of the suction gripper arms is connected to an actuator via a lever, wherein both between the lever and the suction gripper arm, and also between the lever and the actuator, respectively, a pivot joint is formed, and wherein the lever is composed of at least to lever parts.

Abstract: A device is provided for accommodating disk-shaped objects, preferably semiconductor wafers for a thermal treatment thereof. The device has a carrier with at least two recesses for respective objects, and at least one cover for covering at least one of the recesses. A handling apparatus is also provided and has at least one transport arm, at least one support arm, at least one support drive provided on the arm for supporting, via vacuum, at least one object that is to be handled, a device for determining the individual weight of an object, and a vacuum control device for altering the vacuum as a function of the individual weight of an object.

Abstract: A device for receiving plate-shaped objects, preferably semiconductor wafers, for the thermal treatment thereof, enabling the processing of wafers made of connecting semiconductors in a particularly simple manner. The inventive device offers high productivity and low risk of damage as a carrier has at least two recesses for respectively receiving an object. The recesses on the carrier can preferably be provided with covers. Preferably, support pins are provided for loading and unloading purposes. The carrier and the support pins can move in a vertical direction in relation to each other. A handling device for objects is also disclosed.

Abstract: A method of formally treating at least one layer for activating foreign atoms passivated in the layer by hydrogen is provided. The at least one layer is heated, in a first time interval of less than 120 seconds, above a first temperature at which a specific sheet resistance of the at least one layer decreases. The at least one layer is heated, in a second time interval which is within the first time interval and is less than 60 seconds, to above a decomposition temperature of the layer. Charge carriers are produced in the at least one layer during at least one third time interval, by electromagnetic radiation, wherein the energy of such electromagnetic radiation is greater than an energy gap of the at least one layer.