Abstract: Provided is a process for forming a contact for a compound semiconductor device without electrically shorting the device. In one embodiment, a highly doped compound semiconductor material is electrically connected to a compound semiconductor material of the, same conductivity type through an opening in a compound semiconductor material of the opposite conductivity type. Another embodiment discloses a transistor including multiple compound semiconductor layers where a highly doped compound semiconductor material is electrically connected to a compound semiconductor layer of the same conductivity type through an opening in a compound semiconductor layer of the opposite conductivity type. Embodiments further include metal contacts electrically connected to the highly doped compound semiconductor material. A substantially planar semiconductor device is disclosed. In embodiments, the compound semiconductor material may be silicon carbide.

Abstract: Flexible films or sheets for forming high-breakdown strength, high-temperature capacitors are disclosed. Amorphous metal oxides and nitrides, preferably SiO2 or HfO2, with a dielectric constant (k) greater than 2 and stacks of oxides and nitrides formed over conducting substrates may be formed. The dielectrics may be formed by reactive sputter deposition of the amorphous materials onto cooled substrates. The cooled substrate allows the films to be amorphous or nanocrystalline and results in films that can be flexed and that can be rolled into cylindrical shapes. An important application for these dielectrics is in high energy-density wound capacitors.

Abstract: Provided is a process for forming a contact for a compound semiconductor device without electrically shorting the device. In one embodiment, a highly doped compound semiconductor material is electrically connected to a compound semiconductor material of the same conductivity type through an opening in a compound semiconductor material of the opposite conductivity type. Another embodiment discloses a transistor including multiple compound semiconductor layers where a highly doped compound semiconductor material is electrically connected to a compound semiconductor layer of the same conductivity type through an opening in a compound semiconductor layer of the opposite conductivity type. Embodiments further include metal contacts electrically connected to the highly doped compound semiconductor material. A substantially planar semiconductor device is disclosed. In embodiments, the compound semiconductor material may be silicon carbide.

Abstract: A variety of optimal luminescent emitter layers, luminescent devices, and methods of fabricating the same are provided. In accordance with one embodiment of the present invention, an alternating current thin film electroluminescent device is provided including an AC power source and an emitter layer positioned between a pair of electrode layers. One of the pair of electrode layers is transparent to visible light of a selected wavelength. The AC power source is connected across the pair of electrode layers. The emitter layer comprises a non-conductive amorphous alloy comprising aluminum nitride and an Er luminescent center. The emitter layer and the pair of electrode layers are arranged such that, upon activation of the AC power source, an electric field is created between the electrode layers across the emitter layer.

Abstract: A semiconductor structure and a scheme for forming a layer of amorphous material on a semiconductor substrate are provided. In accordance with one embodiment of the present invention, a semiconductor structure is provided comprising an amorphous alloy formed over at least a portion of a semiconductor substrate. The amorphous alloy comprises amorphous aluminum nitride (AlN) and amorphous gallium nitride (GaN). The amorphous alloy may be characterized by the following formula: AlxGa1−xN where x is a value greater than zero and less than one. The amorphous alloy may further comprise indium nitride. Relative proportions of aluminum and gallium in the amorphous aluminum gallium nitride alloy are controlled to engineer the band gap of the amorphous alloy.

Abstract: A semiconductor structure and a scheme for forming a layer of amorphous material on a semiconductor substrate are provided. In accordance with one embodiment of the present invention, a semiconductor structure is provided comprising an amorphous alloy formed over at least a portion of a semiconductor substrate. The amorphous alloy comprises amorphous aluminum nitride (AlN) and amorphous gallium nitride (GaN).

Abstract: A semiconductor structure and a scheme for forming a layer of amorphous material on a semiconductor substrate are provided. In accordance with one embodiment of the present invention, a semiconductor structure is provided comprising an amorphous alloy formed over at least a portion of a semiconductor substrate. The amorphous alloy comprises amorphous aluminum nitride (AlN) and amorphous gallium nitride (GaN).

Abstract: A variety of optimal luminescent emitter layers, luminescent devices, and methods of fabricating the same are provided. In accordance with one embodiment of the present invention, an alternating current thin film electroluminescent device is provided including an AC power source and an emitter layer positioned between a pair of electrode layers. One of the pair of electrode layers is transparent to visible light of a selected wavelength. The AC power source is connected across the pair of electrode layers. The emitter layer comprises a non-conductive amorphous alloy comprising aluminum nitride and an Er luminescent center. The emitter layer and the pair of electrode layers are arranged such that, upon activation of the AC power source, an electric field is created between the electrode layers across the emitter layer.

Abstract: Provided is a process for forming a contact for a compound semiconductor device without electrically shorting the device. In one embodiment, a highly doped compound semiconductor material is electrically connected to a compound semiconductor material of the same conductivity type through an opening in a compound semiconductor material of the opposite conductivity type. Another embodiment discloses a transistor including multiple compound semiconductor layers where a highly doped compound semiconductor material is electrically connected to a compound semiconductor layer of the same conductivity type through an opening in a compound semiconductor layer of the opposite conductivity type. Embodiments further include metal contacts electrically connected to the highly doped compound semiconductor material. A substantially planar semiconductor device is disclosed. In embodiments, the compound semiconductor material may be silicon carbide.