Abstract: An optoelectronic module includes a driver die mounted on a substrate, an optical emitter mounted to an upper surface of the driver die, a spacer mounted to the upper surface of the driver die, and an optical element mounted to an upper surface of the spacer. The spacer encloses and defines a cavity around the optical emitter. The optical element is transparent to light emitted by the optical emitter and includes an interlock feature electrically connected to the driver die.

Abstract: An optoelectronic module includes a driver die mounted on a substrate. The optoelectronic module also includes an optical sensor die mounted on an upper surface of the driver die. The optical sensor die includes at least one optical detector. The driver die is electrically connected to the optical sensor die. The optoelectronic module further includes an optical stack mounted via an adhesive layer to an upper surface of the optical sensor die above the at least one optical detector. The optoelectronic module additionally includes an encapsulant material that laterally encapsulates the optical stack.

Abstract: A sensor module including a sensor and a transparent body which is provided over the sensor, wherein the transparent body comprises a base portion and a convex lens which extends outwardly from the base portion and is located above the sensor, wherein an opaque material is provided on the base portion and surrounds the convex lens.

Abstract: An apparatus comprises an optical sensor package that includes an optical sensor die. The optical sensor package further includes a reflow-stable optical diffuser disposed over the optical sensor die. The optical diffuser is surrounded laterally by an epoxy molding compound.

Abstract: A method for splitting a semiconductor wafer includes incorporating hydrogen atoms into at least a splitting region of a semiconductor wafer. The splitting region includes a concentration of nitrogen atoms higher than 1·1015 cm?3. The method further includes splitting the semiconductor wafer at the splitting region of the semiconductor wafer.

Abstract: A method for splitting a semiconductor wafer includes incorporating hydrogen atoms into at least a splitting region of a semiconductor wafer. The splitting region includes a concentration of nitrogen atoms higher than 1·1015 cm?3. The method further includes splitting the semiconductor wafer at the splitting region of the semiconductor wafer.

Abstract: A method for splitting a semiconductor wafer includes incorporating hydrogen atoms into at least a splitting region of a semiconductor wafer. The splitting region includes a concentration of nitrogen atoms higher than 1·1015 cm?3. The method further includes splitting the semiconductor wafer at the splitting region of the semiconductor wafer.