Abstract: The present invention relates to a method for smoothing a surface of a component, in which a component is placed in a liquid-solids mixture; a relative movement is produced between the liquid-solids mixture and the component; thus there is a flow of the liquid-solids mixture along the surface; wherein there is provided in the liquid-solids mixture a guide surface, along which the liquid-solids mixture flows, wherein a directional component toward the surface is imposed on the flow.

Abstract: The invention relates to a work station for electrochemically machining a workpiece, having a number of recesses, including a base structure; a module which is fastened to the base structure and is configured to electrochemically machine the workpiece. A workpiece holder is fastened to the base structure. The workpiece holder is movable relative to the base structure along a feed axis which is parallel to the axis of rotation of the module. The module includes an electrode carrier arrangement, which is coupled to the module base body so the electrode carrier arrangement can be rotated together with the module base body about the axis of rotation of the module. The electrode carrier arrangement has a carrier frame and an electrode frame, where at least one electrode is detachably fastened to the electrode frame.

Abstract: The invention relates to a work station for electrochemically machining a workpiece, having a number of recesses, including a base structure; a module which is fastened to the base structure and is configured to electrochemically machine the workpiece. A workpiece holder is fastened to the base structure. The workpiece holder is movable relative to the base structure along a feed axis which is parallel to the axis of rotation of the module. The module includes an electrode carrier arrangement, which is coupled to the module base body so the electrode carrier arrangement can be rotated together with the module base body about the axis of rotation of the module. The electrode carrier arrangement has a carrier frame and an electrode frame, where at least one electrode is detachably fastened to the electrode frame.

Abstract: The present invention relates to a method for smoothing a surface of a component, in which a component is placed in a liquid-solids mixture; a relative movement is produced between the liquid-solids mixture and the component; thus there is a flow of the liquid-solids mixture along the surface; wherein there is provided in the liquid-solids mixture a guide surface, along which the liquid-solids mixture flows, wherein a directional component toward the surface is imposed on the flow.

Abstract: The invention relates to a device and a corresponding method for manufacturing brush seals with obliquely positioned bristles. The method comprises the following steps: As the first step, a metal filament or wire (50) comprising a material for bristles is wound over two wire cores (42, 46) disposed at a distance from and running parallel to one another, to form a tightly packed metal filament or wire package (48). As the next step, the metal filament or wire package (48) is fastened to at least one wire core (42, 46). Then the region around at least one of the two wire cores (42, 46) is locally heated. Subsequently, at least one of the two wire cores (42, 46) is displaced.

Abstract: The invention relates to a device and a corresponding method for manufacturing brush seals with obliquely positioned bristles. The method comprises the following steps: As the first step, a metal filament or wire (50) comprising a material for bristles is wound over two wire cores (42, 46) disposed at a distance from and running parallel to one another, to form a tightly packed metal filament or wire package (48). As the next step, the metal filament or wire package (48) is fastened to at least one wire core (42, 46). Then the region around at least one of the two wire cores (42, 46) is locally heated. Subsequently, at least one of the two wire cores (42, 46) is displaced.

Abstract: A joining device for arranging a component on a component carrier is disclosed. The joining device includes an application system for positioning the component in the joining device and a receptacle for clamping the component carrier in the joining device. The component is arranged on the component carrier by an adapter. A method for arranging the component on the component carrier is also disclosed.

Abstract: A mounting device and method for mounting a component is disclosed. The mounting device includes a component carrier and an adapter. The adapter is insertable into a guide of the component carrier. The method uses the mounting device to mount a component on the mounting device.

Abstract: A method for machining a workpiece is disclosed. The method includes fixing a workpiece on a workpiece carrier using an engaging and fixing element by adhering a first mold surface of the engaging and fixing element to an adhesive surface of the workpiece and by adhering a second mold surface of the engaging and fixing element to a contact and adhesive surface of the workpiece carrier. The method further includes machining the workpiece and releasing the first mold surface of the engaging and fixing element from the adhesive surface of the workpiece and releasing the second mold surface of the engaging and fixing element from the contact and adhesive surface of the workpiece carrier.

Abstract: A device (2) having at least one connecting element (24, 26) for fastening a component (4) to, respectively for detaching it from a component carrier (6) using adhesive bonds; a mechanical peeling device (8) being provided for breaking the adhesive bonds. Also a method for fastening a component (4) to, respectively for detaching it from a component carrier (6).

Abstract: A device for fixing a component (4) in position on a component carrier (6) using a radiation-curing adhesive agent (8), in which case the radiation (30, 32) for curing the adhesive agent (8) located between the component carrier (6) and the component (4) is laterally introducible; as well as a method for fixing a component (4) in position in a component carrier (6) using an adhesive bond.

Abstract: A mounting device and method for mounting a component is disclosed. The mounting device includes a component carrier and an adapter. The adapter is insertable into a guide of the component carrier. The method uses the mounting device to mount a component on the mounting device.

Abstract: A method for machining components of a gas turbine, in particular for machining turbine blades, is described. The method includes the following steps: a) providing at least one component carrier having at least one component receptacle for detachable accommodation and fastening component to be machined, the component receptacle being designed with a contour similar to at least one contour of subarea of component to be accommodated; b) introducing at least one subarea of the component into component receptacle and form-fitting and/or substance-to-substance bonding of the subarea of the component to component receptacle; c) machining the component, which is attached to the component carrier; and d) releasing the machined component from the component carrier.

Abstract: A device (2) having at least one connecting element (24, 26) for fastening a component (4) to, respectively for detaching it from a component carrier (6) using adhesive bonds; a mechanical peeling device (8) being provided for breaking the adhesive bonds. Also a method for fastening a component (4) to, respectively for detaching it from a component carrier (6).

Abstract: A joining device for arranging a component on a component carrier is disclosed. The joining device includes an application system for positioning the component in the joining device and a receptacle for clamping the component carrier in the joining device. The component is arranged on the component carrier by an adapter. A method for arranging the component on the component carrier is also disclosed.

Abstract: A device for fixing at least one workpiece on at least one workpiece carrier is disclosed. The device has at least one engaging and fixing element designed as a mold for releasable arrangement between the workpiece and the workpiece carrier, where at least one first mold surface is designed for receiving a first volume of adhesive and for fixing an adhesive surface of the workpiece to the engaging and fixing element. At least one second mold surface of the engaging and fixing element is designed for receiving a second volume of adhesive and for fixing a contact and adhesive surface of the workpiece carrier to the engaging and fixing element. A method for machining workpieces is also disclosed.

Abstract: A device for fixing a component (4) in position on a component carrier (6) using a radiation-curing adhesive agent (8), in which case the radiation (30, 32) for curing the adhesive agent (8) located between the component carrier (6) and the component (4) is laterally introducible; as well as a method for fixing a component (4) in position in a component carrier (6) using an adhesive bond.

Abstract: A method for machining components of a gas turbine, in particular for machining turbine blades, is described. The method includes the following steps: a) providing at least one component carrier having at least one component receptacle for detachable accommodation and fastening component to be machined, the component receptacle being designed with a contour similar to at least one contour of subarea of component to be accommodated; b) introducing at least one subarea of the component into component receptacle and form-fitting and/or substance-to-substance bonding of the subarea of the component to component receptacle; c) machining the component, which is attached to the component carrier; and d) releasing the machined component from the component carrier.

Abstract: A device and a method used when coating a wafer is described. The fluid coating is provided by an inside coating as well as an edge coating. The fluid chocolate in a container is stirred by displacing a vat up and down. During this displacement, the vat will be brought in contact with the wafer, so the chocolate substance, which is provided in there, provides an edge coating. Displacement of the first vat provides a repression of the chocolate substance, which through a nozzle is injected into the wafer in order to provide an inside coating. By repression, a pumping occurs, which is interrupted substantially simultaneously with the edge of the wafer getting in contact with the surface of the chocolate in vat, when it is elevated up towards the wafer, which is suspended in a commonly known apron conveyor (not shown).

Abstract: There is described an apparatus (1) that may be used for providing ice lollies (2) with a coating from a dipping container (4). The coating mix (3) comprises almond flakes (16) and fluid chocolate (10) which is inserted in a third area (38). Displacement bodies (25) are lifted and lowered into first areas (28) while the ice lolly (2) is lowered in a central second area (20). The lowering occurs when the displacement means are completely down whereby a well-defined surface level (23) is achieved by using level plates (21). The movement of the displacement means (25) creates sufficient stirring and flow in flow ducts (36, 43) in order to ensure homogenisation of the coating mix (3) situated in the central second area (20) where the ice lollies (2) are coated.