Abstract: The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.

Abstract: The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.

Abstract: A table with an interface for the connection of a data processing system includes a reading device integrated in the table which cooperates with a transponder. The reading device contains a circuit component for detecting a modulation of an electromagnetic field caused by the transponder as well as a circuit component for generating a signal corresponding to the modulation and transmitting the signal to the interface of the furniture system.