Abstract: A module is provided with a thin-film circuit. To realize the module with a thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate (1) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which is very compact.

Abstract: The invention relates to a thin film circuit with component. The thin film circuit comprises a network of capacitors, or a network of capacitors and resistors, or a network of capacitors, resistors and inductances, or a network of capacitors and inductances. Current supply contacts such as, for example, SMD end contacts or bump end contacts render it possible for the thin film circuit to be connected to further components of a circuit or, for example, to be combined with active components through the use of contact surfaces.

Abstract: The invention describes a method of manufacturing an electronic thin-film component comprising at least one stripline. In this method, first a metallic base layer is deposited on a substrate layer, a photoresist layer is applied to this metallic base layer, and structured in accordance with the stripline(s) to be formed. An electroconductive layer is deposited on the exposed regions of the metallic base layer. Subsequently, the photoresist is removed and the metallic base layer is etched. This method has the advantage that less metal is required as compared to other thin-film methods. Overlapping areas of the striplines can be formed readily, economically, and with small current capacitances by means of bridges. By means of the method described herein, passive components, such as thin-film couplers for high-frequency applications or thin-film coils can be readily obtained.

Abstract: The invention describes a module provided with a thin-film circuit. To realize the module with thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate (1) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which requires little space.

Abstract: The invention relates to a module provided with a thin-film circuit which comprises an integrated trimmable capacitor. At least one electrically conducting layer (2, 4) of the capacitor has a structured surface with recesses. This finger-type design has the result that the actual capacitor is composed of several capacitors connected in parallel. After the total capacitance value has been determined, this total capacitance value can be fine tuned through a selective cutting-off of fingers, i.e. of capacitors, from the main surface of the electrically conducting layer (2, 4).

Abstract: A printhead which comprises a body with pressure chambers (13) and nozzles (14), a membrane (17) connected to the body so as to form one wall of the pressure chambers, and an actuator plate (25) comprising an actuator element (31) for each pressure chamber. A support plate (19) between the actuator plate and the membrane includes first portions (21) and second portions (23) with the first portions being movable relative to the second portions in the direction of the thickness of the support plate, a first portion being situated between each actuator element and the corresponding pressure chamber. The actuator plate has active regions (31) and inactive regions (33), the actuator elements being formed by active regions of the actuator plate. Adjacent actuator elements are separated from each other over substantially their whole length by slits (35) in the actuator plate. The actuator plate can be a ceramic multilayer actuator (CMA).

Abstract: The invention concerns a method of producing a surface layer structure by doping a matrix with metal ions. The aim of the invention is to provide a method of this kind in which the depth distribution of the metal ions in the substrate can be regulated, thus optimumizing the doping without incurring any of the disadvantages inherent in the prior art methods. This is achieved by first depositing matrix material on a suitable substrate by laser ablation in an atmosphere of oxygen, thus forming a on surface of the substrate a first layer a matrix material. Dopant is then deposited on the surface of the first layer, followed by more matrix material. The result is a uniform doping of the deposited matrix at a defined depth in the surface layer structure.