Patents by Inventor Martin Fluegge

Martin Fluegge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stabilized etching solutions for CU and CU/NI layers
    Patent number: 8652972
    Abstract: The present invention relates to new storage-stable solutions which can be used in semiconductor technology to effect specific etching of copper metallization layers and also Cu/Ni layers. With the new etch solutions it is possible to carry out etching and patterning of all-copper metallizations, layers of copper/nickel alloys, and also successive copper and nickel layers.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: February 18, 2014
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Fluegge, Raimund Mellies, Thomas Goelzenleuchter, Marianne Schwager, Ruediger Oesten
  • STABILIZED ETCHING SOLUTIONS FOR CU AND CU/NI LAYERS
    Publication number: 20100304573
    Abstract: The present invention relates to new storage-stable solutions which can be used in semiconductor technology to effect specific etching of copper metallization layers and also Cu/Ni layers. With the new etch solutions it is possible to carry out etching and patterning of all-copper metallizations, layers of copper/nickel alloys, and also successive copper and nickel layers.
    Type: Application
    Filed: August 7, 2006
    Publication date: December 2, 2010
    Applicant: BASF SE
    Inventors: Martin Fluegge, Raimund Mellies, Thomas Goelzenleuchter, Marianne Schwager, Ruediger Oesten