Abstract: The invention includes lead forming and trimming apparatus particularly for transistors with a flat side on the body. Such transistors have a plurality of wire leads extending from the bottom of the body. These wire leads are in an alignment and are fed to a guideway between two strips with these strips at a slope sufficient to cause gravitational advancement of the components on their bottom. A finger metering means is provided and is cam actuated so as to cause one finger to be brought in way of the leading wire of a component as the other finger is being withdrawn from in way of a component in the metering station. The die for shaping and trimming consists of two halves moved first toward each other and then away from each other. The die halves are carried by slide supports and are removably mounted on support blocks. The slides are moved by circular cams enclosed in rectangular followers.

Abstract: This invention pertains to apparatus for processing end-taped electronic components. This apparatus provides means for high-speed trimming, bending, or combinations thereof, of the leads of these components. The dies as assembled portions are carried in blocks for easy removal from reciprocated slide members. Left- and right-hand die assemblies are carried in by blocks removably attached to slide members mounted in groove portions of a support block. This support block may be moved by screw threads on a shaft to provide desired fine adjustment of the trimming of the leads. Barrel-type eccentric cams are carried on this apparatus and are moved in timed relationship to each other and the motor drive. Each of these eccentric cams engages and reciprocably drives box-like follower members which move a slide member, and an associated die block and die assembly. The driven sprocket is positioned between and adjacent the reciprocated die assemblies at the processing station.

Abstract: This invention provides an apparatus and method of setting up apparatus for the automatic cutting and/or shaping of IC components carried in a tubular carrier and advanced for processing by gravity. A base plate is disposed at an angle of approximately forty degrees to the horizontal and provides a supporting means for gravitational feeding of these components from a removable U-shaped retainer to a guide and then to a die station. At this die station a resiliently tired feed wheel engages the body of the IC component which is metered and advanced with an intermittent motion. This motion is provided in a timed relationship with two rotating shafts which have pins moved in a precise orbit around a shaft centerline. These pins are one-hundred-eighty degrees out-of-phase with each other. The rotated feed wheel and attached tire are intermittently moved in a strict timed relationship to the movement of the two shafts by a one-way clutch driven by one of the shafts and by an eccentrically moved Pitman arm.

Abstract: The trimming apparatus and fixture for holding a PC board prior to and during trimming of an upper surface of the PC board utilizes a trimming blade rotated by a variable speed motor. This apparatus includes X and Y motion mechanism moved by hand grips that are spaced apart and cooperate with push button switches providing a safety control circuit. The X and Y motion mechanism employs linear ball bushings mounted and movable on hardened steel shafts. Removable holding fixtures are employed to hold and retain the PC boards during trimming. One holding fixture is used for PC boards that are not warped and not likely to warp. This fixture holds the PC board on three sides and a quick acting cam clamp is actuated to retain and release a PC board. Another fixture is adapted to hold and retain a PC board that is warped or likely to warp. Vacuum is used with a plurality of standoffs to establish the desired holding plane of this PC board.

Abstract: This dispensing apparatus provides a high speed feeding device with a one-at-a-time positive delivery of an electrical component having a generally cylindrical body and two wire-like members. The members are disposed to extend one from each end of the body and substantially central thereof. The dispensing apparatus includes a zig-zag feeder or chute from which the electrical component is delivered to cam actuated plunger means which is reciprocated to present a first supportive position and in response to a cam displacement the component is dropped into a receiver pocket and then moved to a discharge position whereat the transferred component is delivered to other operations.

Abstract: The present apparatus provides for the automatic shaping and/or cutting of the leads of integrated circuit components which are intermittently advanced to and through a straightening and cutting portion of the apparatus. A base plate is disposed at an angle of approximately 40.degree. to the horizontal and provides a base for the gravitational feeding of integrated circuit components carried in plastic guides both before and after trimming. The untrimmed components are fed by gravity to a metering station whereat a rubber roller is intermittently rotated so that each component is brought in way of a pair of opposed processing blades. These blades are simultaneously advanced by eccentric means which are moved in strict timed relationship to the movement of the component in way of the processing blades. As cutoff blades they cooperate with a center guide die to provide the desired shearing action. Both blades and die may be sharpened several times without losing the desired registration.