Abstract: A floating bearing bush for bearing a printed circuit board includes a bearing ring and a soldering ring. The bearing ring includes a tubular opening for receiving a fastening bolt. The soldering ring surrounds the bearing ring and is configured to be soldered by a lower edge onto a printed circuit board. The lower edge of the soldering ring is provided by a continuous wall which is configured to keep a liquid potting compound away from the interior of the soldering ring. The bearing ring is movably suspended within the soldering ring, with the result that the bearing ring is movable at least in a radial direction with respect to the soldering ring.

Abstract: A floating bearing bush for bearing a printed circuit board includes a bearing ring and a soldering ring. The bearing ring includes a tubular opening for receiving a fastening bolt. The soldering ring surrounds the bearing ring and is configured to be soldered by a lower edge onto a printed circuit board. The lower edge of the soldering ring is provided by a continuous wall which is configured to keep a liquid potting compound away from the interior of the soldering ring. The bearing ring is movably suspended within the soldering ring, with the result that the bearing ring is movable at least in a radial direction with respect to the soldering ring.

Abstract: An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.

Abstract: An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a cast material. The at least one connecting element protrudes from the cast material and is configured to connect at least one conductive element. The electronic module is positioned in the transmission and is configured to be operated.

Abstract: An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.

Abstract: An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a cast material. The at least one connecting element protrudes from the cast material and is configured to connect at least one conductive element. The electronic module is positioned in the transmission and is configured to be operated.

Abstract: A method for manufacturing a sensor, in particular for recording rotational speed. At least one stamped grid is provided for electrically contacting the sensor, in particular a sensor element of the sensor. In addition, at least one homogenization plate is provided for influencing a magnetic field, the stamped grid and the homogenization plate being connected by at least one holder. The holder fixes the stamped grid and the homogenization plate in place positively and/or non-positively.

Abstract: A method for manufacturing a sensor, in particular for recording rotational speed. At least one stamped grid is provided for electrically contacting the sensor, in particular a sensor element of the sensor. In addition, at least one homogenization plate is provided for influencing a magnetic field, the stamped grid and the homogenization plate being connected by at least one holder. The holder fixes the stamped grid and the homogenization plate in place positively and/or non-positively.

Abstract: A sensor for a transmission-shift control of a motor vehicle is described. The sensor is connectable to a supply voltage (Vs) and to ground (GND). The sensor generates a signal voltage (Vout). The signal voltage (Vout) may assume two signals (high, low), both signals (high, low) being different from the supply voltage (Vs) and from ground (GND).

Abstract: A method for increasing the information density on a signal-transmission line. The signal-transmission line extends from a sensor to a control unit. A modulated signal, which includes a digital signal, is transmitted on the signal-transmission line. The digital signal assumes either a high level or a low level. The modulated signal includes an encoded pulse signal, which is superimposed on the digital signal and has both an encoded pulse duration and a variable pulse frequency.

Abstract: A control module, in particular for a transmission of a motor vehicle, has a substrate part, a control unit situated on a substrate part, which has a first housing part and a second housing part and a housing interior situated between the first housing part and the second housing part, in which an electronic circuit component attached to the first housing part is situated, and has at least one flexible printed circuit foil for electrically connecting the circuit component to electric components situated outside the housing interior on the substrate part, the first housing part of the control unit being situated flat on a contact area of the substrate part and the second housing part being situated within the contact area on the first housing part.

Abstract: A sensor for a transmission-shift control of a motor vehicle is described. The sensor is connectable to a supply voltage (Vs) and to ground (GND). The sensor generates a signal voltage (Vout). The signal voltage (Vout) may assume two signals (high, low), both signals (high, low) being different from the supply voltage (Vs) and from ground (GND).

Abstract: A control module, in particular for a transmission of a motor vehicle, has a substrate part, a control unit situated on a substrate part, which has a first housing part and a second housing part and a housing interior situated between the first housing part and the second housing part, in which an electronic circuit component attached to the first housing part is situated, and has at least one flexible printed circuit foil for electrically connecting the circuit component to electric components situated outside the housing interior on the substrate part, the first housing part of the control unit being situated flat on a contact area of the substrate part and the second housing part being situated within the contact area on the first housing part.

Abstract: A method for increasing the information density on a signal-transmission line. The signal-transmission line extends from a sensor to a control unit. A modulated signal, which includes a digital signal, is transmitted on the signal-transmission line. The digital signal assumes either a high level or a low level. The modulated signal includes an encoded pulse signal, which is superimposed on the digital signal and has both an encoded pulse duration and a variable pulse frequency.