Abstract: A high-lift device connection assembly (24) for movably connecting a high lift device (16) to a wing (14) of an aircraft (10) wherein a track (30) is movably guided between main rollers (38, 40, 42, 44). In order to provide an enhanced fall back safety feature in case of a failure of a roller the invention proposes a track catcher (92) to be attached to a structure (26) of the wing (14) and configured to bear a load imposed by the track (30) in case of a main roller failure, wherein the track catcher (92) has at least one first hook element (94, 94-1-94-4) engaged within a first recession (72) at a first side of the track (30) and at least one second hook element (96, 96-1-96-4) engaged with a second recession (74) at the second side of the track (30). Further, the invention relates to a wing and an aircraft equipped with such high-lift device connection assembly (24).

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: A method of forming a composite article includes impregnating an inorganic fiber preform with a slurry composition. The slurry composition includes a particulate, a solvent, and a pre-gellant material. Gelling of the pre-gellant material in the slurry composition is initiated to immobilize the particulate and yield a gelled article, and substantially all solvent is removed from the gelled article to form a green composite article. The green composite article is then infiltrated with a molten infiltrant to form the composite article.

Abstract: An arrangement for measuring the diffuse reflection of samples and a method for internal recalibration of the measuring head. The spectrometric measuring head with a device for recalibration comprises a housing which is provided with a window and which contains an illumination source, a spectrometer arrangement and at least two standards for internal recalibration. The two standards can be swiveled into the beam path of the measuring head selectively so that the measurement light emitted by the illumination source can be used in its entirety for recalibration. A processor for acquiring and processing measured values and an interface to a bus system are arranged in the housing. Accordingly, relatively time-consuming calibration of the measuring head at the place of use is required only before putting into operation or at longer time intervals. By the internal recalibrations, it is possible to prevent changes in the measured values in long-term operation.

Abstract: The present invention is directed to an arrangement for measuring the diffuse reflection of samples and to a method for the internal recalibration of the measuring head. According to the invention, the spectrometric measuring head with means for recalibration comprises a housing which is provided with a window and which contains an illumination source, a spectrometer arrangement and at least two standards for internal recalibration. The two standards can be swiveled into the beam path of the measuring head selectively in such a way that the measurement light emitted by the illumination source can be used in its entirety for recalibration. Further, a processor for acquiring and processing the measured values and an interface to a bus system are arranged in the housing. With the solution according to the invention, the relatively time-consuming calibration of the measuring head at the place of use is required only before putting into operation or at longer time intervals.

Abstract: Apparatus and methods for monitoring temperature which employ certain characteristics of diodes in an effective way to monitor the temperature of a heat generating device and enable use of a signal derived from the monitored temperature to control the heat generating device or accessories if so desired.

Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.

Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.

Abstract: An optical measuring arrangement, particularly for quality control in continuous material flow processes, comprising a measuring head which is arranged immediately adjacent to a measurement object, a measurement light source which is held at the measuring head for illuminating a measurement spot on the measurement object, a measurement light reception device, at least one spectrometer which is optically coupled with the measurement light reception device via a light-conducting device, wherein the spectrometer and the light-conducting device are received in the measuring head, and a signal processing device which is likewise received in the measuring head. This results in a compact arrangement for reflection measurement which is easy to assemble and which, beyond this, supplies very accurate measurement results. Further, a measuring arrangement operating on the principle of spectroscopy is suggested for transmission measurement.

Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate, (3) sidewalls connected to, and extending from a plane of the substrate and surrounding the SAW conductors and (4) a lid connected to the sidewalls, the substrate, sidewalls and lid cooperating to form a hermetic enclosure for the SAW conductors.

Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.

Abstract: An optical measuring arrangement, particularly for quality control in continuous material flow processes, comprising a measuring head which is arranged immediately adjacent to a measurement object, a measurement light source which is held at the measuring head for illuminating a measurement spot on the measurement object, a measurement light reception device, at least one spectrometer which is optically coupled with the measurement light reception device via a light-conducting device, wherein the spectrometer and the light-conducting device are received in the measuring head, and a signal processing device which is likewise received in the measuring head. This results in a compact arrangement for reflection measurement which is easy to assemble and which, beyond this, supplies very accurate measurement results. Further, a measuring arrangement operating on the principle of spectroscopy is suggested for transmission measurement.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

Abstract: A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.