Abstract: A coaxial connector includes a center conductor and an outer conductor coaxial with the center conductor. The outer conductor has a cylindrical shape with slits forming a plurality of spring loaded contact elements. The connector further has a base for mounting the coaxial connector and an outer housing. To improve passive intermodulation characteristics, the base, the slotted outer conductor and the outer housing are monolithically made in one piece.

Abstract: An RF-connector system includes an RF-connector with PCB interface, which contains a housing, a coaxial RF-connector interface, and a PCB contact section together with the PCB. A mechanical connection is made by two wing-shaped surface mount sections of the housing having a plurality of surface mount studs adapted to match with pads on the PCB. The electrical connection to the PCB is made by an inner conductor and at least one matching block electrically connected to the housing and providing a matched impedance at the PCB, which has a strip line with a ground plane.

Abstract: An RF-connector system includes an RF-connector with PCB interface, which contains a housing, a coaxial RF-connector interface, and a PCB contact section together with the PCB. A mechanical connection is made by two wing-shaped surface mount sections of the housing having a plurality of surface mount studs adapted to match with pads on the PCB. The electrical connection to the PCB is made by an inner conductor and at least one matching block electrically connected to the housing and providing a matched impedance at the PCB, which has a strip line with a ground plane.

Abstract: A PIM test bench including a first duplexer, having a first port connected via a first filter to a third port and a second port connected via a second filter to the third port. The first port is fed by signal sources providing RF signals at first and second frequencies. A spectrum analyzer is connected to the second port. A device under test is connected between said third port and a third port of a second duplexer. Each of the first and second ports of the second duplexer is connected to a PIM optimized load and/or a standard load. The second duplexer is preferably identical to the first duplexer. For minimizing self-intermodulation, at least the first duplexer comprises at least one filter component and a metal housing. The housing further includes a monolithic metal body and a metal cover capacitively coupled to the body without any galvanic contact.

Abstract: A coaxial connector includes a center conductor and an outer conductor coaxial with the center conductor. The outer conductor has a cylindrical shape with slits forming a plurality of spring loaded contact elements. The connector further has a base for mounting the coaxial connector and an outer housing. To improve passive intermodulation characteristics, the base, the slotted outer conductor and the outer housing are monolithically made in one piece.

Abstract: A PIM test bench including a first duplexer, having a first port connected via a first filter to a third port and a second port connected via a second filter to the third port. The first port is fed by signal sources providing RF signals at first and second frequencies. A spectrum analyzer is connected to the second port. A device under test is connected between said third port and a third port of a second duplexer. Each of the first and second ports of the second duplexer is connected to a PIM optimized load and/or a standard load. The second duplexer is preferably identical to the first duplexer. For minimizing self-intermodulation, at least the first duplexer comprises at least one filter component and a metal housing, the housing further comprises a monolithic metal body and a metal cover capacitively coupled to the body without any galvanic contact.

Abstract: A coaxial RF test connector comprises an inner conductor and an outer conductor arranged coaxially with respect to a center axis. The outer conductor includes a groove dimensioned to hold a circularly shaped contact spring. The contact spring includes a base portion and a plurality of arc-shaped contact fingers extending from the base with gaps between the individual contact fingers. The base has a radius larger than that at which the contact fingers are bent. The contact fingers have first contact section for contacting the outer conductor of a compatible coaxial connector in a direction radial to the center axis, and a second contact section for capacitively coupling to a sidewall of the groove.

Abstract: A low passive intermodulation (PIM) RF rotary switch comprises a plurality of center conductors connected to stationary pads, at least two rotatable pads being connected by a rotatable pad bridge. Depending on the switching state of the switch, at least two stationary pads are in close proximity to at least two rotatable pads, at a distance sufficient to generate/form a RF signal connection between the center conductors via the stationary and rotatable pads.

Abstract: A low passive intermodulation (PIM) RF rotary switch comprises a plurality of center conductors connected to stationary pads, at least two rotatable pads being connected by a rotatable pad bridge. Depending on the switching state of the switch, at least two stationary pads are in close proximity to at least two rotatable pads, at a distance sufficient to generate/form a RF signal connection between the center conductors via the stationary and rotatable pads.

Abstract: A coaxial RF test connector comprises an inner conductor and an outer conductor arranged coaxially with respect to a center axis. The outer conductor includes a groove dimensioned to hold a circularly shaped contact spring. The contact spring includes a base portion and a plurality of arc-shaped contact fingers extending from the base with gaps between the individual contact fingers. The base has a radius larger than that at which the contact fingers are bent. The contact fingers have first contact section for contacting the outer conductor of a compatible coaxial connector in a direction radial to the center axis, and a second contact section for capacitively coupling to a sidewall of the groove.

Abstract: A RF connector assembly, suitable for millimeter waves comprises a housing, holding a transmission line and a RF connector. The transmission line has a band conductor held in an outer conductor. The band conductor is supported by a plurality of holding pins. The holding pins are fixed by holes in the outer conductor and penetrate the inner conductor through holes therein. The holding pins are injection molded parts made of plastic. They comprise of two sections which can be connected together by a plug and socket connection. One end of the transmission line has a printed circuit board contact for contacting a strip line, while the other end of the transmission line has a contact for connecting the inner conductor of the RF connector.

Abstract: Hetero-semiconductor structures possessing an SOI structure containing a silicon-germanium mixed crystal are produced at a low cost and high productivity. The semiconductor substrates comprise a first layer formed of silicon having germanium added thereto, a second layer formed of an oxide and adjoined to the first layer, and a third layer derived from the same source as the first layer, but having an enriched content of germanium as a result of thermal oxidation and thinning of the third layer.

Abstract: An arrangement for calibrating a vector network analyzer (VNA) is substantially secure against operating errors and offers cost-effective calibration by connecting calibration components. Each calibration component includes a transponder and a non-volatile memory which contains, as non-changeable data, at least the type of the component and an individual identification number and, as changeable data, at least the number of calibration processes performed with this calibration component. The VNA includes a wireless interface for reading at least the non-changeable data of a respective calibration component and for incrementing the stored number of the calibration processes performed with this calibration component.

Abstract: An arrangement for calibrating a vector network analyzer (VNA) is substantially secure against operating errors and offers cost-effective calibration by connecting calibration components. Each calibration component includes a transponder and a non-volatile memory which contains, as non-changeable data, at least the type of the component and an individual identification number and, as changeable data, at least the number of calibration processes performed with this calibration component. The VNA includes a wireless interface for reading at least the non-changeable data of a respective calibration component and for incrementing the stored number of the calibration processes performed with this calibration component.

Abstract: Hetero-semiconductor structures possessing an SOI structure containing a silicon-germanium mixed crystal are produced at a low cost and high productivity. The semiconductor substrates comprise a first layer formed of silicon having germanium added thereto, a second layer formed of an oxide and adjoined to the first layer, and a third layer derived from the same source as the first layer, but having an enriched content of germanium as a result of thermal oxidation and thinning of the third layer.

Abstract: Hetero-semiconductor structures possessing an SOI structure containing a silicon-germanium mixed crystal are produced at a low cost and high productivity. The semiconductor substrates comprise a first layer formed of silicon having germanium added thereto, a second layer formed of an oxide and adjoined to the first layer, and a third layer derived from the same source as the first layer, but having an enriched content of germanium as a result of thermal oxidation and thinning of the third layer.