Patents by Inventor Martin Hardis

Martin Hardis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10114426
    Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 30, 2018
    Assignee: Dell Products, L.P.
    Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
  • Publication number: 20160195908
    Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.
    Type: Application
    Filed: March 17, 2016
    Publication date: July 7, 2016
    Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
  • Patent number: 9298227
    Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: March 29, 2016
    Assignee: Dell Products, L.P.
    Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
  • Publication number: 20140340834
    Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.
    Type: Application
    Filed: May 14, 2013
    Publication date: November 20, 2014
    Applicant: Dell Products L.P.
    Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
  • Publication number: 20130052847
    Abstract: An information handling system mezzanine circuit board disposed in a parallel configuration over a motherboard is selectively coupled and de-coupled at the motherboard with a retraction and latching device that translates retraction force applied at an accessible actuation portion to push upward from below the mezzanine circuit board. A retraction portion of the retraction and latching device provides an upward force at the bottom surface of the mezzanine circuit board to separate the mezzanine circuit board connector from the motherboard connector so that an end user can lift the mezzanine circuit board away from the motherboard.
    Type: Application
    Filed: August 25, 2011
    Publication date: February 28, 2013
    Inventors: Stephen N. Figuerado, Martin Hardis
  • Patent number: 8366464
    Abstract: An information handling system mezzanine circuit board disposed in a parallel configuration over a motherboard is selectively coupled and de-coupled at the motherboard with a retraction and latching device that translates retraction force applied at an accessible actuation portion to push upward from below the mezzanine circuit board. A retraction portion of the retraction and latching device provides an upward force at the bottom surface of the mezzanine circuit board to separate the mezzanine circuit board connector from the motherboard connector so that an end user can lift the mezzanine circuit board away from the motherboard.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: February 5, 2013
    Assignee: Dell Products L.P.
    Inventors: Stephen N. Figuerado, Martin Hardis