Patents by Inventor Martin Heimler

Martin Heimler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240334587
    Abstract: An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 3, 2024
    Inventors: Matthias Eisner, Nina Müller, Julian Stefan Breiter, Martin Heimler
  • Publication number: 20100102918
    Abstract: An electromechanical switching device is disclosed for protecting electrical wires and/or consumers. In at least one embodiment, the device includes at least one thermal triggering element and at least one switching device-internal heat source. For the at least one thermal triggering element, the electromechanical switching device includes a thermal coupling of at least one of the switching device-internal heat sources. At least one embodiment of the invention also relates to the use of a thermal coupling.
    Type: Application
    Filed: January 31, 2008
    Publication date: April 29, 2010
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Werner Decker, Martin Heimler