Patents by Inventor Martin Hempen

Martin Hempen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module for arrangement to a transmission component and a method for arranging an electronic module to a transmission component
    Patent number: 10652995
    Abstract: The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 12, 2020
    Assignee: ZF Friedrichshafen AG
    Inventors: Hermann Josef Robin, Martin Hempen, Thomas Maier
  • ELECTRONIC MODULE FOR ARRANGEMENT TO A TRANSMISSION COMPONENT AND A METHOD FOR ARRANGING AN ELECTRONIC MODULE TO A TRANSMISSION COMPONENT
    Publication number: 20190364656
    Abstract: The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).
    Type: Application
    Filed: May 16, 2019
    Publication date: November 28, 2019
    Applicant: ZF Friedrichshafen AG
    Inventors: Hermann Josef Robin, Martin Hempen, Thomas Maier