Patents by Inventor Martin Holzmann

Martin Holzmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor module
    Patent number: 8426930
    Abstract: A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: April 23, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Martin Holzmann, Christian Ohl, Harald Emmerich
  • Current sensor, current measuring module and method for measuring current
    Patent number: 8378675
    Abstract: A current sensor for measuring a current in a conductor includes two magnetic field sensors located adjacent to the conductor. The magnetic field sensors are at least two-dimensional magnetic field sensors having two measuring directions, thereby facilitating compensation for an inhomogeneous interference field.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: February 19, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Wolfgang Hellwig, Valentin Tils, Martin Holzmann, Kerstin Feddern, Friedemann Eberhardt, Michael Munz, Stefan Ruebenacke
  • Chip housing having reduced induced vibration
    Patent number: 7939937
    Abstract: A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: May 10, 2011
    Assignee: Robert Bosch GmbH
    Inventors: Martin Holzmann, Frieder Haag, Michael Knauss, Florian Grabmaier
  • Current sensor, current measuring module and method for measuring current
    Publication number: 20110057650
    Abstract: A current sensor for measuring a current in a conductor includes two magnetic field sensors located adjacent to the conductor. The magnetic field sensors are at least two-dimensional magnetic field sensors having two measuring directions, thereby facilitating compensation for an inhomogeneous interference field.
    Type: Application
    Filed: August 9, 2010
    Publication date: March 10, 2011
    Inventors: Wolfgang Hellwig, Valentin Tils, Martin Holzmann, Kerstin Feddern, Friedemann Eberhardt, Michael Munz, Stefan Ruebenacke
  • Sensor module
    Publication number: 20100271787
    Abstract: A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
    Type: Application
    Filed: March 23, 2010
    Publication date: October 28, 2010
    Inventors: Martin Holzmann, Christian Ohl, Harald Emmerich
  • Chip Housing Having Reduced Induced Vibration
    Publication number: 20090194860
    Abstract: A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.
    Type: Application
    Filed: March 21, 2007
    Publication date: August 6, 2009
    Inventors: Martin Holzmann, Frieder Haag, Michael Knauss, Florian Grabmaier