Patents by Inventor Martin I. Soderland

Martin I. Soderland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for solder reflow bottom cooling
    Patent number: 5785233
    Abstract: An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which has previously had the first side reflow soldered, while at approximately the same time, a heating assembly directs hot gas to a second side of the product. The second side of the product is reflow soldered while the first side of the product is maintained at a temperature below the melting point of the solder.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: July 28, 1998
    Assignee: BTU International, Inc.
    Inventors: Francis C. Nutter, Martin I. Soderland, Richard J. Nihan