Abstract: A heat exchanger for cooling an electronic device combines material, geometry and fin effectiveness to maximize heat transfer rate for a its heat exchanging surface area. The heat exchanger comprises a thermally conductive spacer adapted to be mounted onto a surface of the electronic device. A thermally conductive disk-shaped fin is centered on the spacer and has opposed surface-to-air heat exchanging surfaces extending radially from the spacer generally parallel to the surface of the device. The spacer can be disk-shaped and has a diameter which is less than the diameter of the thermally conductive disk. As such, the heat exchanger is omnidirectional in that it effectively removes heat from the electronic device for an incoming air flow originating from any direction and flowing generally parallel to the surface of the device.

Abstract: A heat dissipator for electronic components comprising a ceramic plate having a first surface for receiving heat from the electronic components and a second surface, and a plurality of separate, spaced metallic, heat-conducting elements mounted on and extending from the second surface of the ceramic plate.