Patents by Inventor Martin Jaegle

Martin Jaegle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder, microelectromechanical component and device, and a process for producing a component or device
    Patent number: 7402910
    Abstract: A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: July 22, 2008
    Assignees: Micropelt GmbH, Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Harald Böttner, Axel Schubert, Martin Jaegle
  • Solder, microelectromechanical component and device, and a process for producing a component or device
    Publication number: 20040238966
    Abstract: A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.
    Type: Application
    Filed: February 27, 2004
    Publication date: December 2, 2004
    Applicant: Infineon Technologies AG
    Inventors: Harald Bottner, Axel Schubert, Martin Jaegle