Patents by Inventor Martin Jeffrey Scattergood

Martin Jeffrey Scattergood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antenna device and manufacturing method thereof
    Patent number: 11600912
    Abstract: An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 7, 2023
    Assignees: Au Optronics Corporation, SES RFID Solutions GmbH
    Inventors: Chung-Hung Chen, Yi-Cheng Lai, Hsiang-Chi Cheng, Shyh-Bin Kuo, Martin Jeffrey Scattergood
  • ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20210184342
    Abstract: An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 17, 2021
    Applicants: Au Optronics Corporation, SES RFID Solutions GmbH
    Inventors: Chung-Hung Chen, Yi-Cheng Lai, Hsiang-Chi Cheng, Shyh-Bin Kuo, Martin Jeffrey Scattergood