Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB.

Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB.