Patents by Inventor Martin John McCaslin

Martin John McCaslin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230008775
    Abstract: In an example, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module includes a detector patch that includes one or more capacitors, each of which has an electrostatic capacity that is variable due to at least deformation of each capacitor. The sensor module also includes an electronics unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to an inside of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inside of the at least one of the tread portion or the sidewall portion. The electronics unit is configured to estimate at least one of the parameters based on the electrostatic capacity of each capacitor.
    Type: Application
    Filed: February 19, 2021
    Publication date: January 12, 2023
    Inventors: Toshihiko OMOTE, Benedicto DELOS SANTOS, Martin John MCCASLIN, John BORTELL, Sean SOUSA, Colton Allen OTTLEY, Jared K. JONAS, Colin D. EICHINGER, Nathan C. BRIGGS
  • Patent number: 9159343
    Abstract: A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: October 13, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Martin John McCaslin, Visit Thaveeprungsriporn, Alex Enriquez Cayaban, Jason Aquinde Gomez
  • Patent number: 9131605
    Abstract: A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: September 8, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Alex Enriquez Cayaban, Martin John McCaslin, Yukimasa Kawato
  • Publication number: 20140293486
    Abstract: An Extended Circuit Integrated Suspension (ECIS) includes: a load beam, including a first plurality of traces disposed on a first side of the load beam and a first connection portion; and a flexure circuit which is disposed on an opposite side of the first side of the load beam and connected to the load beam by the first connection portion, and includes a second plurality of traces and a second connection portion to connect to the first plurality of traces on the load beam.
    Type: Application
    Filed: June 16, 2014
    Publication date: October 2, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Alex Enriquez CAYABAN
  • Publication number: 20140285926
    Abstract: A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.
    Type: Application
    Filed: April 11, 2014
    Publication date: September 25, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Alex Enriquez CAYABAN, Jason Aquinde GOMEZ
  • Patent number: 8817423
    Abstract: An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: August 26, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Alex Enriquez Cayaban
  • Patent number: 8730684
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 20, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
  • Publication number: 20130314882
    Abstract: A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.
    Type: Application
    Filed: May 17, 2013
    Publication date: November 28, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Alex Enriquez CAYABAN, Martin John MCCASLIN, Yukimasa KAWATO
  • Patent number: 8570687
    Abstract: Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: October 29, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Visit Thaveeprungsriporn, Alex Enriquez Cayaban, Jason Aquinde Gomez
  • Patent number: 8434223
    Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho
  • Patent number: 8437100
    Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Visit Thaveeprungsriporn, Szu-Han Hu
  • Patent number: 8367937
    Abstract: A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: February 5, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Voonyee Ho, Takeshi Tanaka, Masami Inoue, Martin John McCaslin
  • Publication number: 20120291260
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.
    Type: Application
    Filed: June 19, 2012
    Publication date: November 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Alex CAYABAN, Szu-Han HU, Yasunari OOYABU, Martin John MCCASLIN
  • Publication number: 20120238072
    Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
    Type: Application
    Filed: June 4, 2012
    Publication date: September 20, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Szu-Han HU, Alex Enriquez CAYABAN, Voon Yee HO
  • Publication number: 20120229934
    Abstract: Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
    Type: Application
    Filed: May 25, 2012
    Publication date: September 13, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Alex Enriquez CAYABAN, Jason Aquinde GOMEZ
  • Publication number: 20120200959
    Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
    Type: Application
    Filed: April 18, 2012
    Publication date: August 9, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Szu-Han HU
  • Patent number: 8233287
    Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: July 31, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
  • Patent number: 8213125
    Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: July 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho
  • Patent number: 8179629
    Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: May 15, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Visit Thaveeprungsriporn, Szu-Han Hu
  • Publication number: 20120008227
    Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
    Type: Application
    Filed: August 19, 2011
    Publication date: January 12, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho