Patents by Inventor Martin John McCaslin
Martin John McCaslin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230008775Abstract: In an example, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module includes a detector patch that includes one or more capacitors, each of which has an electrostatic capacity that is variable due to at least deformation of each capacitor. The sensor module also includes an electronics unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to an inside of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inside of the at least one of the tread portion or the sidewall portion. The electronics unit is configured to estimate at least one of the parameters based on the electrostatic capacity of each capacitor.Type: ApplicationFiled: February 19, 2021Publication date: January 12, 2023Inventors: Toshihiko OMOTE, Benedicto DELOS SANTOS, Martin John MCCASLIN, John BORTELL, Sean SOUSA, Colton Allen OTTLEY, Jared K. JONAS, Colin D. EICHINGER, Nathan C. BRIGGS
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Patent number: 9159343Abstract: A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.Type: GrantFiled: April 11, 2014Date of Patent: October 13, 2015Assignee: NITTO DENKO CORPORATIONInventors: Martin John McCaslin, Visit Thaveeprungsriporn, Alex Enriquez Cayaban, Jason Aquinde Gomez
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Patent number: 9131605Abstract: A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.Type: GrantFiled: May 17, 2013Date of Patent: September 8, 2015Assignee: NITTO DENKO CORPORATIONInventors: Alex Enriquez Cayaban, Martin John McCaslin, Yukimasa Kawato
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Publication number: 20140293486Abstract: An Extended Circuit Integrated Suspension (ECIS) includes: a load beam, including a first plurality of traces disposed on a first side of the load beam and a first connection portion; and a flexure circuit which is disposed on an opposite side of the first side of the load beam and connected to the load beam by the first connection portion, and includes a second plurality of traces and a second connection portion to connect to the first plurality of traces on the load beam.Type: ApplicationFiled: June 16, 2014Publication date: October 2, 2014Applicant: NITTO DENKO CORPORATIONInventors: Martin John MCCASLIN, Alex Enriquez CAYABAN
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Publication number: 20140285926Abstract: A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.Type: ApplicationFiled: April 11, 2014Publication date: September 25, 2014Applicant: NITTO DENKO CORPORATIONInventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Alex Enriquez CAYABAN, Jason Aquinde GOMEZ
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Patent number: 8817423Abstract: An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.Type: GrantFiled: October 9, 2012Date of Patent: August 26, 2014Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Alex Enriquez Cayaban
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Patent number: 8730684Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer.Type: GrantFiled: June 19, 2012Date of Patent: May 20, 2014Assignee: Nitto Denko CorporationInventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
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Publication number: 20130314882Abstract: A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.Type: ApplicationFiled: May 17, 2013Publication date: November 28, 2013Applicant: NITTO DENKO CORPORATIONInventors: Alex Enriquez CAYABAN, Martin John MCCASLIN, Yukimasa KAWATO
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Patent number: 8570687Abstract: Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.Type: GrantFiled: May 25, 2012Date of Patent: October 29, 2013Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Visit Thaveeprungsriporn, Alex Enriquez Cayaban, Jason Aquinde Gomez
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Patent number: 8434223Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.Type: GrantFiled: June 4, 2012Date of Patent: May 7, 2013Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho
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Patent number: 8437100Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.Type: GrantFiled: April 18, 2012Date of Patent: May 7, 2013Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Visit Thaveeprungsriporn, Szu-Han Hu
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Patent number: 8367937Abstract: A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.Type: GrantFiled: August 28, 2009Date of Patent: February 5, 2013Assignee: Nitto Denko CorporationInventors: Voonyee Ho, Takeshi Tanaka, Masami Inoue, Martin John McCaslin
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Publication number: 20120291260Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.Type: ApplicationFiled: June 19, 2012Publication date: November 22, 2012Applicant: NITTO DENKO CORPORATIONInventors: Alex CAYABAN, Szu-Han HU, Yasunari OOYABU, Martin John MCCASLIN
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Publication number: 20120238072Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.Type: ApplicationFiled: June 4, 2012Publication date: September 20, 2012Applicant: NITTO DENKO CORPORATIONInventors: Martin John MCCASLIN, Szu-Han HU, Alex Enriquez CAYABAN, Voon Yee HO
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Publication number: 20120229934Abstract: Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.Type: ApplicationFiled: May 25, 2012Publication date: September 13, 2012Applicant: NITTO DENKO CORPORATIONInventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Alex Enriquez CAYABAN, Jason Aquinde GOMEZ
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Publication number: 20120200959Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.Type: ApplicationFiled: April 18, 2012Publication date: August 9, 2012Applicant: NITTO DENKO CORPORATIONInventors: Martin John MCCASLIN, Visit THAVEEPRUNGSRIPORN, Szu-Han HU
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Patent number: 8233287Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.Type: GrantFiled: February 1, 2008Date of Patent: July 31, 2012Assignee: Nitto Denko CorporationInventors: Alex Cayaban, Szu-Han Hu, Yasunari Ooyabu, Martin John McCaslin
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Patent number: 8213125Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.Type: GrantFiled: August 19, 2011Date of Patent: July 3, 2012Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho
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Patent number: 8179629Abstract: Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.Type: GrantFiled: November 26, 2008Date of Patent: May 15, 2012Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Visit Thaveeprungsriporn, Szu-Han Hu
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Publication number: 20120008227Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.Type: ApplicationFiled: August 19, 2011Publication date: January 12, 2012Applicant: NITTO DENKO CORPORATIONInventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho